Laser processing method

A laser processing method and laser processing technology, which are applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems that affect cutting quality, cannot be separated, excessive ablation of cutting edges, etc., achieve good processing effects, and avoid excessive cutting. Ablation, the effect of improving the degree of exclusion

Inactive Publication Date: 2009-07-08
SHENZHEN MUSEN TECH
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AI Technical Summary

Problems solved by technology

[0003] 1. The heat-affected range of the slit of the processed material is large, and the range and effect of gas cooling are limited, so there will be excessive ablation around the cut edge;
[0004] 2. After some materials are laser cut, the cutting edges are re-adhesive during the cooling process after melting, and cannot be separated, so the cutting effect cannot be achieved.
[0005] 3. The debris at the cutting place cannot be completely removed, which affects the cutting quality

Method used

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Embodiment Construction

[0017] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0018] Please combine figure 1 with figure 2 As shown, the laser processing method of Embodiment 1 of the present invention includes the following steps:

[0019] Step S101, fixing the material to be processed in the container on the workbench.

[0020] The container 1 being fixed on the workbench 6 is a square container with an upper opening, a clamp 11 is installed at its bottom, a water outlet 12 is provided on one side, and a water inlet 13 is provided on the opposite side. When fixing the processed material 2 , it is only necessary to put the processed material 2 from the opening above the container 1 and fix the processed material 2 with the clamp 11 .

[0021] The container described in the embodiment of the present invention can be made of light-transmitting material, so that the operator can observe the laser processing process during the la...

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Abstract

The invention discloses a laser processing method, comprising the following steps: materials to be processed are fixed in a container arranged on a working platform; liquid is injected into the container and the materials to be processed are soaked in the liquid, a laser processing head is soaked in the liquid, laser processing is carried out on the materials to be processed by the laser processing head under the liquid level of the liquid. In the invention, the laser processing head is placed in the liquid for laser processing, therefore, liquid level shake can not affect laser processing precision under water; due to the cooling effect of the liquid, heat affecting of the laser on the processing part is reduced during the laser processing, over-ablation of the laser on the materials is avoided; in addition, the materials can be prevented from being rebound during the cooling process after the materials are melted and the situation that materials can not be separated from each other is avoided; and as the liquid is taken as auxiliary medium of the laser processing, the removal extent of the material fragments is improved and good cutting effect is achieved.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to a laser processing method. Background technique [0002] With the continuous development of laser technology, the application field of laser is more and more extensive, and laser processing is one of the largest fields, which includes laser welding, laser cutting, surface modification, laser marking, laser drilling and micromachining, etc. In the existing industry, laser processing is widely used in automobiles, electronics, electrical appliances, aviation, machinery manufacturing and other fields due to its incomparable advantages. However, the existing laser processing technology mostly relies on the thermal effect of the laser to achieve the processing purpose, so the negative effect brought by the thermal effect is inevitable. For example, laser cutting is to irradiate the processed material with the laser beam after focusing, and the light energy is converted into heat energ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/14B23K26/122
Inventor 汤海林彭信翰杨伟
Owner SHENZHEN MUSEN TECH
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