The invention provides a detection control system for laser de-bonding. In a laser de-bonding process, a suction cup is adsorbed on the surface of a substrate, a laser beam sequentially penetrates through the suction cup and the substrate and then is focused on a bonding layer, and after the focus of the laser beam is controlled to be behind a unit area of a scanning part of the bonding layer, a lifting assembly pulls a suction cup upwards, so that the substrate and the wafer are separated at the position of the unit area, the stripping mode that laser de-bonding and suction cup pulling are carried out at the same time is adopted, the substrate and the wafer are prevented from being adhered again due to the fact that a bonding material in a molten state is cooled and solidified again, and therefore the stripping difficulty is reduced. And a semi-reflecting and semi-transmitting mirror, a detection light source, a beam splitting prism, a light spot detection assembly and an upper computer are arranged, so that laser spot position information and bonding layer heated condition information of a local area can be observed in real time, the upper computer can control a galvanometer system to adjust a scanning track and scanning time of a laser beam, and the laser de-bonding efficiency and effect are improved.