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38results about How to "Reduce the chance of bad" patented technology

Liquid crystal display panel and method for producing same

ActiveCN102023406AReduce the chance of badImprove the utilization rate of ultraviolet lightNon-linear opticsLiquid-crystal displayUltraviolet lights
The present invention relates to a liquid crystal display panel and a manufacturing method thereof. The liquid crystal display panel comprises a first substrate and a second substrate that are assembled opposite to each other; liquid crystal is filled between the display area of the said first substrate and the display area of the said second substrate; sealing glue is formed between the peripheral area of the said first substrate and the peripheral area of the said second substrate; a reflection layer is formed on the peripheral area of the said first substrate or the peripheral area of the said second substrate. The said reflection layer is used to reflect the incident ultraviolet light to the said sealing glue in the process of assembling the said first substrate and the said second substrate. The liquid crystal display panel and the manufacturing method thereof provided in the present invention increase the utilization rate of ultraviolet light in the process of solidifying the sealing glue when assembling the two substrates by arranging reflection layers on the peripheral area of one of the two substrates that constitute the liquid crystal display panel, and helps to lower the probability of defects occurring to the LCD panel.
Owner:BEIJING BOE OPTOELECTRONCIS TECH CO LTD

Array substrate and display device

An embodiment of the invention discloses an array substrate and a display device. The array substrate comprises a substrate body, and multiple scanning lines and multiple data lines are arranged on the substrate body to form multiple subpixels in intersection; pixel electrodes arranged in the subpixels include multiple stripline electrodes, long axes of the stripline electrodes in the same row ofthe subpixels are parallelly mutually, and the long axes of the stripline axles in any two rows of the subpixels extend in intersection; each touch electrode is electrically connected with at least one touch signal line, each touch signal line comprises multiple straight line parts and multiple folding line parts, the two neighboring straight line parts are connected through the folding line parts, the straight line parts are parallel to the long axles of the stripline electrodes located in the same raw of the subpixels, extending lines of the folding line parts interact the long axes of the stripline electrodes, and orthographic projection of the folding line parts on the substrate body overlap with that of the scanning lines on the substrate while the folding line parts are not perpendicular to the scanning lines. By the arrangement, the problem that display effect is affected by uneven pressure.
Owner:XIAMEN TIANMA MICRO ELECTRONICS

Aluminum-containing film layer pattern, manufacturing method and post processing method therefor

The invention discloses an aluminum-containing film layer pattern, a manufacturing method and a post processing method therefor. A patterned photoresist layer which covers a to-be-patterned aluminum-containing film layer is used as a mask, and the to-be-patterned film layer is subjected to a dry-etching process through chlorine-including gas; and then the formed patterned aluminum-containing film layer is subjected to dechlorination treatment and uninstalling of a bearing substrate at the same time. Due to that the dechlorination treatment and the uninstalling of the bearing substrate are carried out at the same time, the intermediate equipment waiting time is omitted, so that the processing duration of the overall post processing process is shortened, and the productivity can be improved; in addition, the dosage of the gas in the dechlorination treatment and the uninstalling of the bearing substrate can be reduced, so that the cost can be lowered; moreover, due to that the dosage of the gas in the dechlorination treatment and the uninstalling of the bearing substrate is reduced, the damage to the patterned photoresist layer can be lowered, suspension particles generated by attachment in equipment cavities are reduced, the probability of adverse residue generation in the subsequent substrate dry-etching process is lowered, and the daily maintenance period of the equipment is prolonged consequently.
Owner:BOE TECH GRP CO LTD +1

Fixture for machining outer circle of commutator

InactiveCN103341771AReduce the number of repeated targetingReduce machining errorsPositioning apparatusMetal-working holdersCommutatorEngineering
The invention discloses a fixture for machining an outer circle of a commutator. The fixture for machining the outer circle of the commutator is characterized by comprising an air cylinder (1), a pull rod (2), a positioning mandrel and a positioning block (4), wherein the pull rod (2) is connected with the air cylinder, the pull rod is arranged in the positioning mandrel, the tail portion of the pull rod (2) is arranged to be of an I-shaped groove structure, and the positioning block (4) is placed in a groove. According to the fixture for machining the outer circle of the commutator, the head portion of the positioning mandrel (3) is arranged in an inner hole of the commutator in a sleeved mode, the positioning block (4) is placed in the I-shaped groove of the pull rod (2), the pull rod (2) tensions the positioning block (4) under the action of tension of the air cylinder (1), and thus positioning of the commutator is carried out. By the adoption of the mode, turning can be directly carried out on the outer circle and the end face of the commutator, and the purpose of one-time forming is achieved. Meanwhile, repeated positioning errors of repeated machining of commutator products are reduced, and machining efficiency of the products can be effectively improved.
Owner:瑞安博宇科技股份有限公司

Fan-out type packaging structure and packaging method

The invention provides a fan-out type packaging structure and a fan-out type packaging method, and belongs to the technical field of chip packaging. The fan-out type packaging structure comprises a plate-shaped base material, an accommodating groove is formed in a plate surface at one side of the plate-shaped base material, a first rewiring layer and a second rewiring layer are respectively formedon two side plate surfaces of the plate-shaped base material; the first rewiring layer and the second rewiring layer are connected through a conductive column. The conductive columns penetrate through the plate-shaped base material; a first chip is accommodated in the accommodating groove; a circuit bonding pad of the first chip is located at the side far away from the bottom of the accommodatinggroove and is connected with the first rewiring layer; a first shielding body is arranged in the accommodating groove, the periphery of the first chip is covered with the first shielding body, the side, away from the plate-shaped base material, of the second rewiring layer is connected with a second chip, a second shielding body is formed on the second rewiring layer, and the periphery of the second chip is covered with the second shielding body. The packaging structure can shield electromagnetic interference between chips so as to avoid badness caused by mutual interference between the chipsand improve the product performance of the packaging structure.
Owner:FOREHOPE ELECTRONICS NINGBO CO LTD

Diaphragm laminating device and method, display module and touch diaphragm

The invention relates to a diaphragm laminating device and method, a display module and a touch diaphragm. The diaphragm laminating device comprises a base, a traction mechanism and a laminating mechanism. According to the diaphragm laminating device and method, when a second laminating object is laminated to a first laminating object, manual dragging and diaphragm tearing are not needed, and a protection diaphragm is gradually rolled automatically or manually through the corresponding traction mechanism, so that the labor cost is saved, the production efficiency is improved, the rate of defective products in the manual diaphragm tearing process is lowered, and the yield rate of products is improved. In the laminating process, the bending angle of the second laminating object can be stillkept smaller than 90 degrees, so that the problems of breakage of the second laminating object or breakage of surface coatings or printed ink due to excessive bending are solved, and the yield of theproduct is further better improved. The diaphragm laminating device and method are particularly suitable for laminating of large-dimension diaphragm products, and have the advantages of being high inlaminating efficiency, stable and reliable in laminating process and the like.
Owner:GUANGZHOU SHIYUAN ELECTRONICS CO LTD +1

Novel method for manufacturing LED chips

The invention discloses a novel method for manufacturing LED chips. The novel method includes performing MESA photoetching and NP (negative and positive) photoetching, and particularly includes performing vacuum evaporation on the surfaces of epitaxial slices to obtain ITO (indium tin oxide) layers, then coating photoresist on the surfaces of the epitaxial slices, then performing MESA photoetching on the epitaxial slices to obtain photoresist layers with MESA pattern layers, etching ITO of the ITO layers and downwardly etching the surfaces of the epitaxial slices; removing the photoresist layers with the MESA pattern layers; performing vacuum evaporation on steps of the ITO layers and N-GaN layers to obtain SiO<2> layers, coating photoresist on the steps of the ITO layers and the N-GaN layers, and performing NP photoetching on the photoresist layers to obtain photoresist layers with NP patterns; etching the SiO<2> layers; forming P electrodes and N electrodes in regions obtained after the SiO<2> layers are etched; removing the photoresist layers with the NP pattern layers. The novel method has the advantages that the production cost can be effectively reduced, the production cycle can be shortened, and the yield can be increased.
Owner:SHANDONG CHENGLIN PHOTOELECTRIC TECH +1

Cover plate structure of flexible display module, flexible display module and flexible display equipment

The invention relates to a cover plate structure of a flexible display module, the flexible display module and flexible display equipment. The cover plate structure of the flexible display module comprises an organic cover plate layer and a flexible glass layer which are attached to each other, the flexible glass layer is provided with a first part and a second part, the first part is located in an area, corresponding to a bendable area of the flexible display module, on the cover plate structure, and the second part is located in an area, corresponding to a non-bending area of the flexible display module, on the cover plate structure; the first part of the flexible glass layer is thicker than the second part; or the flexible glass layer is only arranged in the area, corresponding to the non-bending area of the flexible display module, of the cover plate structure. According to the scheme, the overall resilience force of the flexible display module can be reduced when the flexible display module is bent, and attachment between the layers of structures can be better maintained. In addition, the dislocation amount of the edge of the supporting layer when the flexible display module is bent can be reduced, and therefore the probability that a Pad bending area of the flexible display module is damaged in a jacking mode is reduced.
Owner:BOE TECH GRP CO LTD

Hot melt film one-time forming laminating process method and device

The invention provides a hot melt film one-time forming laminating process method and device. The process method comprises the following steps: 1) fusing a laminating part and a hot melt part on one piece of equipment; the three working procedures of fusion fitting, defoaming and hot melting fitting being one fitting working procedure, so that a working mode of synchronously finishing fitting and hot melting is realized; (2) designing the equipment into a double-wheel structure, the hot melt film being accurately attached to the surface of a product through a pressing roller of the attaching part, completely exhausting gas between attaching faces to enable the attaching faces to be free of bubble residues, and heating the hot melt film and performing edge sealing through a hot melt roller along with pressure. The device adopts a double-wheel structure, deaeration and hot pressing are completed in one step, and the problems that due to product structure factors, a traditional technology and traditional equipment must adopt the technology of firstly attaching, then deaeration and finally hot melting and pressing, the production efficiency is influenced, inconsistency is generated due to long retention time of products, and the product reliability is influenced are solved. The manufacturing time is shortened, and the stability of the product is improved.
Owner:奇新光电股份有限公司

Circuit boards and their applications

The invention relates to a circuit board and application thereof. The circuit board comprises a substrate and an etching metal circuit located over the substrate. The substrate is provided with at least one pair of through holes, inside of the through holes and substrate base between the two through holes are provided with a conductive coating, and the substrate and the etching metal circuit form a conducted closed loop. According to the circuit board provided by the invention, the etching metal circuit is arranged over the substrate to replace the conventional circuit formed by printing silver circuits on the substrate, conductive circuits are compactly concentrated on a metal layer, probability of generating defective circuits while printing is reduced, and yield is increased; and the substrate is drilled, the inside of the through holes and the substrate base are provided with the conductive coating, the formed conducted closed loop can replace the existing jumper technology, production processes can be decreased, difficulty in process is reduced, and production cost is saved greatly. Application of the circuit board provided by the invention comprises using the circuit board as a light guide plate of an illuminant keyboard, and just by directly using the circuit board in cooperation with a light-emitting diode, light emitting at base of the keyboard can be realized.
Owner:JIANGSU TRANSIMAGE TECH CO LTD

Circuit board and application thereof

The invention relates to a circuit board and application thereof. The circuit board comprises a substrate and an etching metal circuit located over the substrate. The substrate is provided with at least one pair of through holes, inside of the through holes and substrate base between the two through holes are provided with a conductive coating, and the substrate and the etching metal circuit form a conducted closed loop. According to the circuit board provided by the invention, the etching metal circuit is arranged over the substrate to replace the conventional circuit formed by printing silver circuits on the substrate, conductive circuits are compactly concentrated on a metal layer, probability of generating defective circuits while printing is reduced, and yield is increased; and the substrate is drilled, the inside of the through holes and the substrate base are provided with the conductive coating, the formed conducted closed loop can replace the existing jumper technology, production processes can be decreased, difficulty in process is reduced, and production cost is saved greatly. Application of the circuit board provided by the invention comprises using the circuit board as a light guide plate of an illuminant keyboard, and just by directly using the circuit board in cooperation with a light-emitting diode, light emitting at base of the keyboard can be realized.
Owner:JIANGSU TRANSIMAGE TECH CO LTD

membrane switch

The invention relates to a thin-film switch. The thin-film switch comprises an upper conducting circuit, a lower conducting circuit and an insulation part located between the upper conducting circuit and the lower conducting circuit; the lower conducting circuit comprises a base material and an etching metal circuit located above the base material; the base material is provided with at least a pair of through holes; conductive coatings are arranged at the inner parts of the through holes and the bottom of the base material which is located between the two through holes; and the base material and the etching metal circuit form a conductive closed loop. As a traditional circuit formed by silver lines printed on the base material is replaced by the etching metal circuit arranged above the base material and the conducting circuit is compactly concentrated on a metal layer, the probability of poor circuits during printing is reduced and the yield is increased; meanwhile, holes are drilled in the base material, the conductive coatings are arranged in the through holes and at the bottom of the base material and the formed conductive closed loop can replace an existing insulation layer and an existing jumper wire, so that production procedures are reduced, technology difficulty is decreased, production cost is greatly saved, and the saved cost is about 40% of a traditional thin-film switch.
Owner:JIANGSU TRANSIMAGE TECH CO LTD
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