100results about How to "Reduce the number of photolithography" patented technology

The invention relates to a fast recovery epitaxial diode comprising a metal cathode layer, an N + substrate silicon chip, a first epitaxial layer, a second epitaxial layer, a third epitaxial layer, wherein the above-mentioned parts are successively connected. A mesa silicon groove penetrates the third epitaxial layer and is extended into the second epitaxial layer; a glass passivation layer that is arranged inside the mesa silicon groove and is provided with a window is extended to the top surface of the third epitaxial layer; and a metal anode layer that is arranged at the upper portion of the glass passivation layer passes through the window that is arranged on the glass passivation layer and then is connected with the third epitaxial layer. According to the invention, an epitaxial technology is used to accurately control impurity concentration and thickness of all the epitaxial layers; and a mesa channeling technology and a glass passiviation technology are utilized to manufacture a terminal structure, thereby substantially reducing a technology flow. Besides, the fast recovery epitaxial diode has good consistency and repeatability; high quality characteristics including low forward direction voltage drop, super speediness, and soft recovery characteristic and the like of the fast recovery epitaxial diode can be easily realized.

The invention discloses a SiC metal-oxide-semiconductor field-effect transistor (MOSFET) device and a fabrication method thereof. The SiC MOSFET device comprises a plurality of cells, wherein the cells are connected through interconnection metal (12), each cell comprises a grid, a grid oxide layer, two sources, an N-type drift layer, an N+ buffer layer, an N+ substrate, a drain and an isolation medium. According to the process step disclosed by the invention, in a photoetching plate subjected to tapping in a contact region, contact metal evaporation and stripping, a source electrode region is provided with a pattern, and a pattern also exists in a pad region of the grid.

The invention discloses a preparation method of a back-contact heterojunction solar cell. A pre-passivation layer of intrinsic amorphous silicon, an N-type amorphous silicon layer and an anti-reflection layer are sequentially deposited on the front side of the washed and dedamaged layer and the velveted monocrystalline silicon substrate; Depositing an intrinsic amorphous silicon back passivation layer on the back surface of the battery; The P-type amorphous silicon layer is deposited on the surface of the back passivation layer by a mask method, and then the insulation isolation layer betweenthe P-type amorphous silicon layer and the N-type amorphous silicon layer is directly deposited, and the insulation isolation layer is etched according to the preset width of the insulation isolationlayer by a photolithography method; Further depositing an N-type amorphous silicon layer on the back surface by a mask method; At last, that transparent conductive film is sequentially deposite by adopting a mask proces, and the metal film forms a contact layer, thereby completing the preparation of the solar cell of the invention. The invention improves the preparation process precision of the back surface structure pattern of the HBC single crystal silicon solar cell, reduces the width of the isolation layer, and improves the collection probability of the photogenerated carriers and the short-circuit current density of the HBC solar cell.

Embodiments of the invention provide a manufacturing method of a GaN-based light emitting diode. The method comprises the following steps of forming an epitaxial lamination on a substrate; forming a current barrier layer pattern and a transparent conducting layer pattern on the epitaxial lamination; carrying out dry etching so that a part of N-type first semiconductor layer is exposed so as to form a table board; forming an insulation protection layer on the table board, carrying out electrode lithography on the insulation protection layer so as to form a first electrode opening and a second electrode opening, and forming a metal electrode in each electrode opening so as to form a light emitting diode. By using the manufacturing method of the GaN-based light emitting diode, through adjusting lithography of each structure and an etching sequence, in a total process flow, the lithography only needs to be performed for three times so that the light emitting diode which has a same structure with the structure of the light emitting diode obtained through using a routine technology is acquired; manufacturing time of the light emitting diode is shortened; and material cost and production cost are reduced.

The invention relates to a method for manufacturing a thin-film transistor baseplate, which comprises the following steps: an insulating base is provided; a grid groove is formed on the insulating base; a grid metal layer is deposited; chemical and mechanical grinding is performed to the grid metal layer to form a grid electrode; a grid insulating layer, a semiconductor layer and a first passivation layer are deposited in sequence; a source electrode groove and a drain electrode are formed; a source/drain electrode metal layer is deposited; chemical and mechanical grinding is performed to the source/drain electrode metal layer to form a source electrode and a drain electrode; a second passivation layer is deposited; a pixel electrode groove is formed and the drain electrode is exposed; a conductor layer is deposited; and a pixel electrode is formed.

The invention discloses a method for improving the alignment of a lithography mark, an epitaxial layer for the alignment of the lithography mark, and a preparation method for a super-junction, and belongs to the field of micro-electronic chips. The method comprises the steps: providing a substrate with an epitaxial layer, wherein the epitaxial layer is provided with a groove which is far from thetop surface far of the substrate and extends inwards from the top surface, the groove is limited by a bottom wall and a side wall, the bottom wall is parallel to the top surface of the epitaxial layer, and the side wall extends towards the epitaxial layer along the top surface; and forming films on a part of the side wall or on the whole side wall. The method facilitates the obtaining of the better and easier alignment effect in the subsequent manufacturing process during lithography marking.

The invention relates to a two-dimensional electronic material device and a mixed photoetching method thereof, wherein the method comprises the following steps: forming at least one lead metal layer on a substrate, and performing optical photoetching on the at least one lead metal layer so as to form at least one layer of lead figures, wherein an uppermost layer comprises a plurality of upper layer leads, and a grid electrode, a source electrode and a drain electrode are respectively connected with one upper layer lead; forming an electrode metal layer; performing the optical photoetching on the electrode metal layer so as to form a transistor region; performing electron-beam photoetching on the electrode metal layer so as to form the figures of the grid electrode, the source electrode and the drain electrode; forming a grid dielectric layer; performing the optical photoetching on the grid dielectric layer so as to form the figure of the grid dielectric layer; forming the figure of a two-dimensional electronic material layer; and forming the figure of an ohmic contact layer. The device is capable of eliminating or decreasing the destruction of intrinsic properties of the two-dimensional electronic material, capable of greatly improving the photoetching precision of small-size devices based on guaranteeing the process cost and improving the performance of the devices, and capable of saving the processing time based on guaranteeing the processing precision.

Following steps are carried out by using traditional technique: photo etching from up distributed Bragg reflector to ohmic contact layer in dual groove shape; depositing P type ohmic contact electrode Ti/Pt/Au; peeling off procedure reserves Ti/Pt/Au on ohmic contact layer only; etching down no mask protected up distributed Bragg reflector, ohmic contact layer and AlxGa1-xAs(x is greater than or equal to 0.9) wet nitrogen oxidation respectively in registration photoetching procedure by using photoresist and P type ohmic contact electrode Ti/Pt/A as masks; Removing photoresist, wet nitrogen oxidating forming oxidation aperture; n type ohmic contact electrode obtained after thinning and polishing. Disclosed method obtains product by using photoetching device in low precision.

The invention discloses an infrared transmitting high sensitivity visible light detector and a preparation method thereof. The detector is composed of a passivation layer, an upper electrode, a heterojunction, a lower electrode and an intrinsic monocrystalline silicon substrate. The upper electrode is made of a material which is conductive and is transparent to visible light and infrared. The heterojunction comprises an upper heterojunction layer and a lower heterojunction layer. The upper heterojunction layer is nano-film which is sensitive to the visible light and can transmit the infrared.The lower heterojunction layer is intrinsic monocrystalline silicon. When the visible light and the infrared transmit the upper electrode and the upper heterojunction layer, the visible light stimulates electron hole pairs in the heterojunction, the electron hole pairs are collected by the upper electrode and the lower electrode and are discharged from longitudinally set metal columns, and the infrared passes through a whole detection structure, so the visible light is detected, and moreover, transmission of the infrared is not influenced. Compared with a conventional structure, the detector has the advantages that distance between the electrodes and a junction area is low, so recombination rates of the electron hole pairs can be reduced before the electron hole pairs reach the electrodes,and collection efficiency of photon-generated carriers is improved. Through longitudinal metal structure design, light shielding is reduced, and sensitivity is improved.

The thin film transistor device includes following parts: a transparent glass base plate; gate electrode; insulating layer of gate electrode for partitioning scan line of gate electrode from scan line of source electrode; active layer, doping layer; source/drain electrodes; passivation layer for partitioning scan line of source electrode from transparent pixel electrode. Gate insulating layer under the active layer includes three layers of insulating medium. Dielectric constant of middle insulating-film is lower than Dielectric constants of insulating-film at upper layer and insulating-film at lower layer. Thus, the device possesses lower leaping voltage so as to restrain flicker and crosstalk on liquid crystal display of using the thin film transistor as well as improve quality of displayed images.

The invention discloses a semiconductor structure manufacturing method, which comprises the following steps of: providing a substrate, wherein the substrate is divided into a fuse region with a fuse structure and a bonding pad region with a bonding pad, the fuse structure comprises a first anti-etching layer on a surface layer and the bonding pad comprises a second anti-etching layer on the surface layer; forming a protective layer; forming a photoresist layer on the protective layer, patterning the photoresist layer and forming an opening in the photoresist layer, wherein the opening exposesthe protective layer at a part of a bonding pad position, at a fuse structure position and on the two sides of the fuse structure position; performing primary etching until the first anti-etching layer of the fuse region and the second anti-etching layer of the bonding pad region are exposed at the same time; and performing secondary etching to remote the second anti-etching layer on the surface layer of the bonding pad and the first anti-etching layer on the surface layer of the fuse structure. In the method, a process of performing single photoetching and then sequentially performing the primary and secondary etching is adopted to reduce photoetching times.

The invention discloses a manufacturing method of a bidirectional power device. The manufacturing method comprises the following steps: forming a first doped region in a semiconductor layer; forming aplurality of trenches in a first trench region, wherein the plurality of trenches of the first trench region are located in the first doped region and divide the first doped region into alternating first-type sub-doped regions and second-type sub-doped regions; forming a gate dielectric layer covering the side walls of the lower parts of the plurality of trenches of the first trench region; forming a shielding dielectric layer covering the side walls of the upper parts of the plurality of trenches of the first trench region; and forming gate conductors respectively in contact with the gate dielectric layer and the shielding dielectric layer in the plurality of trenches of the first trench region, wherein the gate conductors comprise control gates and shielding gates which are connected with each other, the control gates are in contact with the gate dielectric layer, and the shielding gates are in contact with the shielding dielectric layer. According to the manufacturing method, the first doped region is divided into the first-type sub-doped regions and the second-type sub-doped regions which are alternated by the trenches to form a source region and a drain region of the bidirectional power device, so the area of the device is reduced.

The invention discloses a double-gate electrode metal oxide thin film transistor and a preparation method thereof. The double-gate electrode metal oxide thin film transistor comprises a substrate; a bottom gate electrode, a bottom gate insulating layer, a metal oxide semiconductor layer and a passivation layer sequentially arranged on the substrate, and a source electrode, a drain electrode, a first top gate electrode and a second top gate electrode arranged on the passivation layer; a flat layer and a pixel electrode layer. The source electrode, the drain electrode, the first top gate electrode and the second top gate electrode are located on the same layer, and the second top gate electrode is connected with the bottom gate electrode through a bottom gate electrode contact hole. The topgate electrode, the source electrode and the drain electrode are made of the same layer of metal, the top gate and the bottom gate are in signal communication to form the double-gate structure device,the process is simple, and the cost is saved.

The invention provides a preparation method of a semiconductor device, and relates to the technical field of a semiconductor preparation process, and the method comprises the steps of: covering a wafer with a non-photosensitive substance layer; covering the non-photosensitive substance layer with a photosensitive substance layer; forming preset patterns on the photosensitive substance layer and the non-photosensitive substance layer through a one-time composition process to expose the surface of the wafer, wherein a first opening is formed in the photosensitive substance layer, a second opening is formed in the non-photosensitive substance layer, and the caliber of the first opening is smaller than that of the second opening; forming a first depth groove in the exposed wafer; forming a second depth groove in the groove bottom of the first depth groove, wherein the width of the second depth groove is smaller than or equal to that of the first depth groove; and removing the remaining non-photosensitive substance layer and photosensitive substance layer on the wafer. The semiconductor device can be formed through a one-time composition process, thereby saving the photoetching step, reducing the step of removing photoresist, and improving the preparation efficiency by reducing the photoetching times.

The invention relates to a multi-grid changing field effect transistor structure, a manufacturing method thereof and a chip device. A transistor comprises a drain epitaxial layer located at a bottom layer, a source layer located at a top layer, and source extension inverted fins, a first grid and a second grid which are embedded in the drain epitaxial layer; the first grid electrode is arranged between the source electrode extension inverted fins, the second grid electrode is aligned to the source electrode extension inverted fins, and symmetrical channels which are connected in parallel from the source electrode layer to the interior of the drain electrode epitaxial layer in pairs are formed in the two sides of the first grid electrode and the two sides of the second grid electrode respectively; and in a preferred example, the drain epitaxial layer forms a shield gate bottom floating antipolar column bottom junction at a bottom portion corresponding to the source extension inverted fin. The field effect transistor architecture provided by the invention is a multi-grid-electrode change densification, and has the effects of uniformizing electron flow partitions of the drain electrode on the back surface of the substrate and the source electrode on the top surface of the substrate and reducing the grooving process.

The invention discloses a 1T1R and 1R resistive random access memory integrated structure and an implement method thereof. Resistive random access memory structures with MIM structures are manufactured on a drain electrode and a source electrode of an original substrate transistor respectively at the same time, a first layer of metal front medium, a first layer of plug, a first layer of metal, a second layer of inter-layer medium, a second layer of plug, an MIM structure layer, a third layer of inter-layer medium, a third layer of plug, a second layer of metal and a passivation layer are sequentially and respectively formed above the drain electrode and the source electrode of the substrate transistor, and the substrate transistor is connected with resistive random access memories in series. The resistive random access memory in the 1T1R structure and the resistive random access memory in the 1R structure are manufactured at the same time, the technological conditions are completely the same, the photo-etching times can be reduced, manufacturing cost is reduced, meanwhile, the 1T1R structure and the 1R structure are integrated, the characteristics of the resistive random access memories in the two structures can be compared conveniently, and the effect on the changing characteristic of a device from the current overshoot can be studied.