Fabrication method of semiconductor structure
A manufacturing method, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of consumption, time and production costs, etc., to save time and cost, reduce photolithography The number of times, the effect of guaranteed performance
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[0028] In the process of forming the pad and the fuse structure, in order to improve the reliability of the device, it is usually necessary to perform two photolithography and etching processes, one is to protect the fuse area with photoresist, and the protective layer in the pad area An opening is formed in the fuse area to expose the solder pad, and then the photoresist in the fuse area is stripped; the other time, the photoresist is used to protect the solder pad area, forming an opening in the protective layer of the fuse area, and leaving part of the protective layer on The fuse structure is used for subsequent laser repair, and then the photoresist in the pad area is stripped off. Since two photolithography needs to be performed and two photomasks are used, more time and production costs are required.
[0029] In view of the above-mentioned problems, the present invention forms the pattern of the solder pad and the fuse structure on the same mask plate at the same time afte...
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