5results about How to "Improve process tolerance" patented technology

The invention relates to the technical field of conductive thin film materials, in particular to a preparation method and application of a pure-carbon-series self-supporting conductive thin film. Comprising the following steps: S1, uniformly stirring and mixing multi-walled carbon nanotube slurry, single-walled carbon nanotube slurry and graphene slurry, adding a film-forming agent oily solution, and uniformly mixing to obtain a coating material; s2, coating a substrate with the coating material in the S1, and then drying and stripping to obtain the pure-carbon-series self-supporting conductive thin film, the sheet resistance of the pure carbon system can reach 4.2 omega / square, and the sheet resistance of a thin film prepared in a general laboratory is less than 20 omega / square and is superior to that of an existing pure carbon film (generally gt and 20 omega / square), and the pure carbon film can be driven under the low voltage of 5V. Due to the characteristic, the deicing device is particularly suitable for the fields of flexible wearable equipment, consumer electronics, deicing in special environments and the like.

The utility model discloses an assembling structure of a steel bar four-way three-dimensional hoop, which comprises a vertical hoop, a transverse hoop is arranged on the lower side of the vertical hoop, a vertical hoop is arranged on the right side of the vertical hoop, and a longitudinal hoop is arranged on the right side of the vertical hoop. Through the steel bar four-way three-dimensional hoop in an assembled combination form, grounding connection operation can be carried out on a plurality of steel bars, the device is simple in structural assembly, the steel bar grounding connection operation can be completed by only one person, the construction efficiency of the device is effectively improved, meanwhile, when the device is used for grounding connection of the steel bars, cutting-off treatment does not need to be carried out on steel bar connection nodes, and the construction cost is reduced. And the process application range is wider, a power source and a tool are not needed for steel bar grounding assembly, the device application construction scene is wider, the assembly joints of the steel bars are fixed through four bolts, and the process fault tolerance is high.

The invention discloses a manufacturing method of a U-shaped groove, which is characterized in that a photoresist reserved on a field oxide in an X-direction photoetching process of the U-shaped groove can protect a hard mask on the field oxide of a Y-direction opening of a non-U-shaped groove region, the loss of the hard mask on the field oxide of the Y-direction opening of the non-U-shaped groove region cannot be caused, and a U-shaped groove process window is enlarged; in the process of performing X-direction silicon etching to form a U-shaped groove, silicon at an X-direction opening at a non-overlapping position of an X-direction opening pattern and a Y-direction opening pattern is protected by a mask first silicon oxide layer and a mask second silicon nitride layer, when the mask at the position is removed, the mask second silicon nitride layer is removed firstly, then the first silicon oxide layer is removed, and the first silicon oxide layer is removed after the mask second silicon nitride layer is removed. The SIN hard mask on the field oxide is not damaged, and the morphology standard of the U-shaped groove can be ensured.

[Problem] The present invention aims to provide an aqueous solution for manufacturing electronic devices capable of suppressing defects. [Solution] An aqueous solution for manufacturing electronic devices, comprising: an acid (A); a surfactant (B); and a solvent (C); wherein the acid (A) has a pKa (H2O) of 3.0 or less, and the number of carbon atoms contained in one molecule of the acid (A) is 0 to 8; the surfactant (B) substantially contains no ethylene oxide repeating units and no propylene oxide repeating units; and the solvent (C) contains water (C-1). The aqueous solution for manufacturing electronic devices is a high-performance material that can be used in nanotechnology processes for semiconductor device manufacturing, for example, in manufacturing processes for semiconductor devices for controlling liquid crystals, quantum dots, or OLED displays formed on a substrate.

The invention relates to a linear adjustable pressure-slippage combined sensing liquid alloy flexible electronic skin for closed-loop grabbing of a robot, and relates to the technical field of liquid alloy microfluidic devices. Comprising an upper-layer elastic base body, a lower-layer elastic base body, a first liquid alloy micro-channel conduit array, a second liquid alloy micro-channel conduit array, a continuous insulation isolating layer and an end connecting structure, the first liquid alloy micro-channel conduit array is arranged in the upper-layer elastic matrix, and the second liquid alloy micro-channel conduit array is arranged in the lower-layer elastic matrix; the continuous insulation isolation layer is arranged between the first liquid alloy micro-channel conduit array and the second liquid alloy micro-channel conduit array; the end connecting structure is connected with the first liquid alloy microchannel catheter array and the second liquid alloy microchannel catheter array. A mutual capacitance sensing array is formed through upper and lower layering, orthogonal crossing and continuous insulation isolation layers, and flexible touch sense and slippage sensing of parts such as fingertips, palms and joints of a robot are achieved.