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Microchip substrate bonding method and microchip

A bonding method and microchip technology, applied in chemical instruments and methods, microelectronic microstructure devices, microstructure technology, etc., can solve the problems that glass substrates are not suitable for mass production and high cost

Inactive Publication Date: 2012-10-03
KONICA MINOLTA OPTO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since glass substrates are not suitable for mass production and are very expensive, development of inexpensive and disposable resin microchips is desired

Method used

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  • Microchip substrate bonding method and microchip
  • Microchip substrate bonding method and microchip
  • Microchip substrate bonding method and microchip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0043] refer to figure 1 A method of bonding microchip substrates according to Embodiment 1 of the present invention and a microchip manufactured by the method will be described. figure 1 It is a cross-sectional view of a microchip substrate for explaining the method of bonding microchip substrates according to Embodiment 1 of the present invention.

[0044] Such as figure 1 As shown in (a), groove-shaped fine flow paths 11 are formed on the surface of the microchip substrate 10 . The microchip substrate 20 that is the counterpart to be bonded to the microchip substrate 10 is a flat substrate. By joining the microchip substrate 10 and the microchip substrate 20 with the surface on which the fine flow path 11 is formed as the inside, the microchip substrate 20 serves as a cover for the fine flow path 11 to form a microchip. In addition, the microchip substrates 10 and 20 correspond to an example of the "resin member" of the present invention.

[0045] Resin is used for t...

Embodiment approach 2

[0088] Below, refer to figure 2 A method of bonding microchip substrates according to Embodiment 2 of the present invention and a microchip manufactured by the method will be described. figure 2 It is a cross-sectional view of a microchip substrate for explaining a method of bonding microchip substrates according to Embodiment 2 of the present invention. In the first embodiment described above, the fine flow paths are formed on only one microchip substrate, but in the second embodiment, the fine flow paths are formed on both microchip substrates.

[0089] Such as figure 2 As shown in (a), a microchip substrate 10 having fine flow paths 11 formed on its surface and a microchip substrate 30 similarly having fine flow paths 31 formed on its surface are prepared. By joining the microchip substrate 10 and the microchip substrate 30 with the microchannel 11 and the microchannel 31 as insides, a deeper microchannel is formed.

[0090] Then, if figure 2 As shown in (b), SiO is...

Embodiment 1

[0098] (microchip substrate)

[0099] The transparent resin material, that is, cyclic polyolefin resin (manufactured by ZEON Corporation, Japan, ZEONOR), was molded by an injection molding machine, and a plurality of microscopic particles with a width of 50 μm and a depth of 50 μm were produced on a plate-shaped part with an external dimension of 50 mm × 50 mm × 1 mm. A channel-side microchip substrate consisting of a channel and a plurality of through-holes with an inner diameter of 2 mm. This channel-side microchip substrate corresponds to the microchip substrate 10 in the first embodiment in which the fine channel 11 is formed. In addition, as the cover side microchip substrate, a transparent resin film (ZEONOR film manufactured by Nippon Zeon Co., Ltd.) cut to the same size as that of the channel side microchip substrate was used. The thickness of the film was 100 μm. This film-shaped cover-side microchip substrate corresponds to the microchip substrate 20 serving as a c...

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Abstract

Provided is a bonding method for manufacturing a microchip by forming a hydrophilic film on an inner surface of a fine channel and easily bonding the substrates with each other. On a microchip substrate (10) having a fine channel (11) formed on the surface, a SiO2 film (12) is formed on the surface whereupon the fine channel (11) is formed. The SiO2 film is formed on the surface (bonding surface) where the inner surface of the fine channel (11) and a microchip substrate (20) are bonded with each other. A SiO2 film (21) is also formed on a surface (bonding surface) where the board-like microchip substrate (20) and the microchip substrate (10) are bonded with each other. Then, the microchip substrate (10) and the microchip substrate (20) are bonded with each other by activating the surfaces of the SiO2 films (12, 21).

Description

technical field [0001] The present invention relates to a method of bonding microchip substrates formed with grooves for flow channels, and a microchip produced by the method. Background technique [0002] Micro-analysis chips or μTAS ( Micro Total Analysis Systems) devices are being put into practical use. Advantages of such a microchip include reducing the amount of samples and reagents used and the amount of waste liquid discharged, saving space, and being an inexpensive system that is portable and portable. [0003] A microchip is manufactured by bonding two parts in which at least one part has been microfabricated. Conventionally, a glass substrate is used for a microchip, and various microfabrication methods have been proposed. However, since glass substrates are not suitable for mass production and are very expensive, development of inexpensive and disposable resin microchips has been desired. [0004] In addition, in such an element that passes a liquid through a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N35/08G01N37/00B01J19/00
CPCB29C66/028B01L3/502707B29C66/5346B29L2031/756B01L2200/0689B29C65/1432B81C3/001B01L2300/161B29C65/1403B29C65/483B81B2201/058B01L2200/12B29C65/002B29C66/53461B29C66/54B29C65/48B29C66/026B01L2300/0887B29C65/1406B29C66/929B81C2203/038B29C65/1483B29C65/8246B29C66/1122B29C66/71B29C66/72325B29C66/73161B29C66/733B29C66/73366B29C66/7352B29C66/73921B29K2995/0072
Inventor 平山博士
Owner KONICA MINOLTA OPTO
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