Printed Circuit Board Manufacturing Method Using Photosensitive Dry Film to Realize Selective Plugging
A printed circuit board, photosensitive technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problem of selective plugging of substrates that cannot have high aspect ratio through holes, and is not suitable for high aspect ratio through hole plugging operations , unable to meet the problems of selective plug hole and so on
Active Publication Date: 2011-12-07
COMPEQ MFG
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Problems solved by technology
[0005] Although the existing screen printing plugging equipment can meet the requirement of selective plugging, it is not suitable for the plugging operation of high aspect ratio vias
Although the existing non-screen printing plugging equipment is suitable for the plugging operation of high aspect ratio vias, it cannot meet the demand for selective plugging
Therefore, neither existing screen printing plugging equipment nor non-screen printing plugging equipment can perform selective plugging operations on substrates with high aspect ratio vias
Method used
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[0016] Figure 1 to Figure 6 A preferred embodiment of the method of manufacturing a printed circuit board of the present invention is shown, wherein it is indicated that the method of manufacturing a printed circuit board includes the steps described later.
[0017] First, provide the figure 1 The substrate 1 shown is a substrate with copper foil on both sides, but is not limited thereto, for example, a multi-layer substrate including copper foil on the surface and inner wiring. In this example, the substrate 1 has a dielectric layer 20 and two metal layers 10 coated on the upper and lower surfaces of the dielectric layer 20 respectively. In addition, the substrate 1 has a plurality of holes formed by mechanical or laser drilling in the direction of its plate thickness. These holes include the first hole 3 that needs to be filled with plug hole material and the first hole 3 that does not need to be filled with plug hole material. Second hole 4. In this example, the holes a...
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The invention provides a method for making a printed circuit board for selectively plugging holes by using a photosensitive dry film. a separate hole cover. These hole covers only cover those holes on the substrate that do not need to be filled with the plugging material, so that only those holes that need to be filled with the plugging material on the substrate are exposed. In this way, in the subsequent plugging step, only the holes without hole caps will be filled with the plugging material, so as to achieve the purpose of selectively plugging the holes without the aid of the stencil jig.
Description
technical field [0001] The invention relates to the technology of plugging holes in the process of printing circuit boards, in particular how to realize the technology of selectively plugging holes with non-screen printing equipment in the process of manufacturing printed circuit boards. Background technique [0002] For the plugging operation in the printed circuit board process, traditionally, non-screen printing plugging equipment or screen printing plugging equipment can be used according to the needs. [0003] The so-called non-screen printing plugging equipment generally refers to those plugging devices that do not use stencil fixtures, such as vacuum plugging machines commonly used in the industry, which are usually suitable for plugging operations of high aspect ratio through holes. However, there is no selectivity for filling resin ink on a substrate with the non-screen printing hole plugging device, that is, all the holes on the substrate will be filled with resin ...
Claims
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IPC IPC(8): H05K3/00
Inventor 江衍青方士嘉黄秀玲李金修徐华鸿
Owner COMPEQ MFG