Manufacture method of printed circuit board (PCB) by utilizing photosensitive dry film to realize plugging holes selectively
A printed circuit board, photosensitive technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problem of selective plugging of substrates that cannot have high aspect ratio through holes, and is not suitable for high aspect ratio through hole plugging operations , unable to meet the problems of selective plug hole and so on
Active Publication Date: 2009-11-25
COMPEQ MFG
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Problems solved by technology
[0005] Although the existing screen printing plugging equipment can meet the requirement of selective plugging, it is not suitable for the plugging operation of high aspect ratio vias
Although the existing non-screen printing plugging equipment is suitable for the plugging operation of high aspect ratio vias, it cannot meet the demand for selective plugging
Therefore, neither existing screen printing plugging equipment nor non-screen printing plugging equipment can perform selective plugging operations on substrates with high aspect ratio vias
Method used
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[0016] Figure 1 to Figure 6 A preferred embodiment of the method of manufacturing a printed circuit board of the present invention is shown, wherein it is indicated that the method of manufacturing a printed circuit board includes the steps described later.
[0017] First, provide the figure 1 The substrate 1 shown is a substrate with copper foil on both sides, but is not limited thereto, for example, a multi-layer substrate including copper foil on the surface and inner wiring. In this example, the substrate 1 has a dielectric layer 20 and two metal layers 10 coated on the upper and lower surfaces of the dielectric layer 20 respectively. In addition, the substrate 1 has a plurality of holes formed by mechanical or laser drilling in the direction of its plate thickness. These holes include the first hole 3 that needs to be filled with plug hole material and the first hole 3 that does not need to be filled with plug hole material. Second hole 4. In this example, the holes a...
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Abstract
The invention provides a manufacture method of a printed circuit board (PCB) by utilizing a photosensitive dry film to realize plugging holes selectively. The method mainly comprises the following steps: pasting the photosensitive dry film on a base plate and forming a plurality of independent hole caps on the base plate in an exposure developing way. The hole caps only cap holes which are arranged on the base plate and do not need to be filled with hole plugging materials, therefore, only holes needing to be filled with hole plugging materials on the base plate are exposed, the hole plugging materials are filled in the holes without the hole caps in the following hole plugging processes, thereby achieving the purpose of selectively plugging holes without the assistant of a screen grid clamp.
Description
technical field [0001] The invention relates to the technology of plugging holes in the process of printing circuit boards, in particular how to realize the technology of selectively plugging holes with non-screen printing equipment in the process of manufacturing printed circuit boards. Background technique [0002] For the plugging operation in the printed circuit board process, traditionally, non-screen printing plugging equipment or screen printing plugging equipment can be used according to the needs. [0003] The so-called non-screen printing plugging equipment generally refers to those plugging devices that do not use stencil fixtures, such as vacuum plugging machines commonly used in the industry, which are usually suitable for plugging operations of high aspect ratio through holes. However, there is no selectivity for filling resin ink on a substrate with the non-screen printing hole plugging device, that is, all the holes on the substrate will be filled with resin ...
Claims
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Inventor 江衍青方士嘉黄秀玲李金修徐华鸿
Owner COMPEQ MFG