Dual side cooling integrated power device package and module and methods of manufacture

Abstract

An integrated power device module having a leadframe structure with first and second spaced pads and one or more common source-drain leads located between said first and second pads, first and secondtransistors flip chip attached respectively to said first and second pads, wherein the source of said second transistor is electrically connected to said one or more common source-drain leads, and a first clip attached to the drain of said first transistor and electrically connected to said one or more common source-drain leads. In another embodiment a partially encapsulated power quad flat no-lead package having an exposed top thermal drain clip which is substantially perpendicular to said with a folded stud exposed top thermal drain clip, and an exposed thermal source pad.

Description

[0001] Cross References to Related Applications

[0002] This application claims priority to US Patent Application Serial No. 11 / 829,793, filed July 27,2007. technical field

[0003] The present invention relates generally to the packaging of semiconductor devices and, more particularly, to double side cooled integrated power device modules and methods of manufacturing the same. Background technique

[0004] Small packages for semiconductors with short leads are desirable for forming compact electronic circuits. However, such small packages create problems in dissipating heat from packaged power devices used in electronic circuits. In many cases, the heat dissipation capabilities of the leads alone are not sufficient to provide reliable operation of the power device. In the past, heat sinks have been attached to such devices to help dissipate heat.

[0005] Another factor in forming compact circuits is the amount of space required for wire bonding in conventional package...

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