Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for spraying printing ink on circuit board

A spraying device and circuit board technology, which is applied in the secondary treatment of printed circuits, coating of non-metallic protective layers, etc., can solve the problems of difficult miniaturization, contamination of the surface of circuit boards, and easy sticking, etc., to improve efficiency and improve Convenience and the effect of improving the pass rate

Inactive Publication Date: 2011-04-20
ASIA NEO TECH IND
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the above-mentioned problem that the volume of the traditional ink spraying machine is difficult to miniaturize, and the problem that the purchase cost of the described spraying machine is difficult to reduce, and overcome the above-mentioned follow-up that is easy to stick and pollute the circuit due to ink staining on the fixture. problems with the surface of the board, and the problem of reducing the efficiency of spraying ink on the board in order to remove the ink from the jig, while overcoming the above-mentioned problem of difficulty in picking up the board without contact with the ink

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for spraying printing ink on circuit board
  • Method and device for spraying printing ink on circuit board
  • Method and device for spraying printing ink on circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] first look figure 1 Shown, disclose the flow chart of the ink spraying method of circuit board of the present invention, illustrate that the present invention comprises following implementation steps:

[0042] In step S11, use more than one clamp 3 clamping a circuit board 8 in the ink spray chamber 20 (matched figure 2 shown).

[0043] In step S12, the clamp 3 is moved into the spray booth 20 (with Figure 3 to Figure 5 shown), and the circuit board 8 is moved into the interior of the spray booth 20 with the fixture 3 .

[0044] In step S13, the fixture 3 is positioned in the spray booth 20 (with Figure 3 to Figure 5 As shown), the circuit board 8 is positioned inside the spray booth 20 along with the fixture 3 .

[0045] In step S14, use an ink spray gun 1 that can move more than two axially in the spraying chamber 20, and carry out the first electrostatic spraying step by step along the side of the circuit board 8 (with Figure 8 to Figure 11 As shown), the op...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method and a device for spraying printing ink on a circuit board. The method comprises the steps of: using at least two fixtures on the top of a printing ink spraying chamber to hold the circuit board, positioning the circuit board in the spraying chamber, using a printing ink gun which can move along more than two axial directions at one side of the spraying chamber, and electro-statically spraying the immobile circuit board for at least one time so as to coat the printing ink on the whole circuit board. By using the method, the immobile circuit board can be electro-statically sprayed for one or more times by using a single printing ink gun, so as to save the installment space and cost of a circuit board electro-static spraying device.

Description

technical field [0001] The invention provides an ink spraying method and a device for a circuit board, in particular to a method and a device for electrostatically spraying a circuit board with an ink spray gun. Background technique [0002] After the outer circuit of the printed circuit board (PCB) is completed, it must go through a coating operation of solder resist green paint, which is mainly to apply a layer of ink on the surface of the circuit board first, so that the ink is covered Then the circuit board is baked to promote the drying of the ink on the surface of the circuit board's outer circuit to form an insulating layer, so as to avoid the oxidation of the outer circuit and soldering short circuit, etc., and facilitate the subsequent The operation of welding group electronic parts is carried out. [0003] The above-mentioned method of coating ink on the surface of the circuit board includes screen printing, curtain coating and electrostatic spraying, etc.; room,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/28
Inventor 叶步章
Owner ASIA NEO TECH IND
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com