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Lithographic apparatus and method for correcting a position of a stage of a lithographic apparatus

One type of lithography equipment and another technology, applied in microlithography exposure equipment, optomechanical equipment, photolithography process exposure devices, etc., can solve the problem of not meeting the future needs of lithography technology, unsatisfactory positioning accuracy, etc. question

Active Publication Date: 2014-09-03
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] It has been found that the positioning accuracy in one or more directions can be unsatisfactory, especially not meeting the future needs of lithography

Method used

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  • Lithographic apparatus and method for correcting a position of a stage of a lithographic apparatus
  • Lithographic apparatus and method for correcting a position of a stage of a lithographic apparatus
  • Lithographic apparatus and method for correcting a position of a stage of a lithographic apparatus

Examples

Experimental program
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Effect test

Embodiment Construction

[0018] figure 1 A lithographic apparatus according to an embodiment of the invention is schematically shown. The lithographic apparatus includes: an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., ultraviolet (UV) radiation or any other suitable radiation); a patterning device support structure mask table (e.g., a mask A stage) MT configured to support a patterning device (eg mask) MA and connected to a first positioning device PM for precisely positioning the patterning device MA according to determined parameters.

[0019] The apparatus also includes a substrate table (e.g., wafer table) WT or "substrate support structure" configured to hold a substrate (e.g., a resist-coated wafer) W and configured for A second positioner PW for precisely positioning the substrate W is connected. The apparatus also includes a projection system (e.g. a refractive projection lens system) PS configured to project the pattern imparted to the radiation be...

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PUM

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Abstract

The invention discloses a lithographic apparatus and a method for correcting the position of a stage of the lithographic apparatus. The lithographic apparatus comprises: a stage for holding an object, the stage being movable relative to a reference structure over a range of motion; a magnet structure for providing a spatially varying magnetic field over at least a portion of the range of motion, the magnet structure is movable relative to the reference structure and the stage; a first position measurement system for providing a first measurement signal corresponding to the stage and / or the object being measured a position relative to the reference structure in direction; a second position measurement system to provide a second measurement signal corresponding to the position of the stage relative to the magnet structure; and a data processor for relying on the second measurement The value of the signal corrects the first measurement signal to provide a corrected first measurement signal representative of the position of the stage and / or the object in the measurement direction relative to the reference structure.

Description

technical field [0001] The invention relates to a lithographic apparatus and a method for correcting the position of a stage relative to a reference structure of the lithographic apparatus. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or more dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred by imaging the pattern onto a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a network of adjacent target portions that a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70516G03F7/70775G03F7/70783G03F7/70758G03F7/70716G03F7/70833H01L21/0274
Inventor H·巴特勒E·J·M·尤森W·H·G·A·考恩E·A·F·范德帕斯卡H·K·范德斯考特M·W·M·范德维基斯特M·M·P·A·沃梅尤恩C·A·L·德霍恩
Owner ASML NETHERLANDS BV