Synthetic aperture three-dimensional ultrasonic imaging method based on non-diffraction array waves

An ultrasonic imaging method and synthetic aperture technology, which are applied in ultrasonic/sonic/infrasonic diagnosis, sonic diagnosis, infrasonic diagnosis, etc., can solve the problem of low imaging frame rate, achieve high imaging resolution, improve imaging frame rate, and transmit times. less effect

Inactive Publication Date: 2014-04-02
UNIV OF SCI & TECH OF CHINA
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Problems solved by technology

In addition, even if a 2D sensor is used in 3D imaging, if the existing time-lapse superposition imaging method is used, it still needs quite a few transmission and reception processes to complete a frame of volume imaging, and the problem of low imaging frame rate still exists

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  • Synthetic aperture three-dimensional ultrasonic imaging method based on non-diffraction array waves
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  • Synthetic aperture three-dimensional ultrasonic imaging method based on non-diffraction array waves

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specific Embodiment approach

[0017] The specific embodiment of the present invention is described below in conjunction with accompanying drawing: Ultrasonic transmitting circuit [1] drives 1D ultrasonic sensor array [2] to emit non-diffracting array wave or plane ultrasonic sound field, after launching, 1D ultrasonic sensor array [2] is converted into receiving signal state, the transmitted ultrasonic wave is reflected by the imaging target [3] during propagation to form an echo signal, and then converted into a received signal by the 1D ultrasonic sensor array [2], and the received signal is converted by a signal amplifier and an analog-to-digital (A / D) The sensor [4] converts it into a digital signal and saves it, and then the 1D ultrasonic sensor array [2] moves to the next position under the control of the synthetic aperture data processing unit [5], and repeats the above-mentioned transmitting sound field and receiving feedback of the imaging target [3]. The scanning process of the wave signal (such a...

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Abstract

The invention discloses a synthetic aperture three-dimensional ultrasonic imaging method based on non-diffraction array waves or plane wave sound fields. In the method, a one-dimensional sensor array is adopted for emitting non-diffraction array waves or plane wave sound fields, the one-dimensional sensor array is moved to scan the whole imaging zone, and a synthetic aperture technology is adopted for comprehensively processing and imaging echo signals in the whole target zones. The sensor can be moved in a mechanical scanning way or in a way of exciting rows or columns of a two-dimensional array in sequence. In order to re-create a three-dimensional image, firstly, the echo signals are subjected to Fourier transformation, and the transformed frequency spectrum signals are subjected to variable transformation so that the frequency spectrum of the image can be obtained; and then the three-dimensional imaging of the imaging object can be completed through Fourier transformation. In all the current three-dimensional ultrasonic imaging methods, the imaging method disclosed by the invention has the characteristics of high imaging speed and high imaging quality and has an extremely favorable application prospect.

Description

Technical field: [0001] The invention belongs to the field of medical ultrasonic imaging, uses a 1D (One Dimension, 1D) sensor to emit a non-diffraction array wave sound field, uses synthetic aperture technology to comprehensively process the echo signals of the entire target area, and uses Fourier transform to realize three-dimensional (Three Dimension, 3D) imaging. Background technique: [0002] Compared with two-dimensional (Two Dimension, 2D) ultrasound imaging, 3D ultrasound imaging has the advantages of intuitive image display, accurate measurement of the position of biological organs, shortening the time required for doctor's diagnosis, and improving the accuracy of diagnosis. clinical application value. [0003] 3D ultrasound imaging methods are mainly divided into two types in terms of the sensors used: imaging using 2D array sensors and imaging using 1D sensors. Due to the complexity of the 2D sensor process, it has not been widely used. Currently, 1D sensors are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61B8/00
Inventor 彭虎韩志会
Owner UNIV OF SCI & TECH OF CHINA
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