Solid-state imaging device
A solid-state imaging device and image technology, which can be used in electrical solid-state devices, image communications, semiconductor devices, etc., and can solve problems such as inability to correct the offset and deformation of projected images.
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no. 1 approach
[0031] figure 1 It is a block diagram showing a schematic configuration of the solid-state imaging device according to the first embodiment of the present invention.
[0032] exist figure 1 Among them, the solid-state imaging device 1 is provided with: an image sensor 2, a timing signal generation circuit 3, an A / D converter 4, a signal processing circuit 5, an image position correction circuit 6, an image signal interface circuit 7, a register interface 8, and a correction circuit. Parameter register 9.
[0033] Here, the image sensor 2 is capable of imaging, and includes a pixel array unit in which pixels are arranged in a matrix. The timing signal generation circuit 3 can generate timing signals so that the image sensor 2 , the A / D converter 4 , the signal processing circuit 5 , the image position correction circuit 6 , and the video signal interface circuit 7 can operate in cooperation. The A / D converter 4 can digitize the imaging signal output from the image sensor 2 ....
no. 2 approach
[0120] Figure 14 is a cross-sectional view showing a schematic configuration of a solid-state imaging device according to a second embodiment of the present invention.
[0121] exist Figure 14 In this embodiment, an image sensor 2 is formed on a semiconductor chip 101 , and an attenuation electrode (pad electrode) 103 is formed around the semiconductor chip 101 . In addition, it is also possible to form on the semiconductor chip 101 figure 1 Timing signal generation circuit 3, A / D converter 4, signal processing circuit 5, image position correction circuit 6, signal interface circuit 7, register interface 8 and correction parameter register 9.
[0122]On the other hand, land electrodes 105 are formed on the motherboard 104 . In addition, the semiconductor chip 101 is mounted on the mother substrate 104 , and the attenuation electrode 103 and the protruding electrode 105 are connected by bonding wires 106 . In addition, a lens barrel 107 is arranged on the motherboard 104 ...
no. 3 approach
[0125] Figure 15 It is a block diagram showing a schematic configuration of a solid-state imaging device according to a third embodiment of the present invention.
[0126] exist Figure 15 Among them, on the solid-state imaging device 21a, an image sensor 22a, a timing signal generating circuit 23a, an A / D converter 24a, a signal processing circuit 25a, an image position correction circuit 26a, an image signal interface circuit 27a, a register interface 28a and Calibration parameter register 29a. In addition, a coordinate conversion unit 30a is provided on the image position correction circuit 26a. Here, a lens 31a is arranged in front of the image sensor 22a.
[0127] On the solid-state imaging device 21b, an image sensor 22b, a timing signal generation circuit 23b, an A / D converter 24b, a signal processing circuit 25b, an image position correction circuit 26b, an image signal interface circuit 27b, a register interface 28b, and correction parameters are provided. Regist...
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