Method for improving sapphire crystal ingot bar taking yield
A sapphire and yield technology, applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve the problems of reducing the yield of sapphire crystal ingot 1, limiting the number of sapphire crystal ingots, and sapphire crystal loss, etc. Achieve the effect of improving cutting efficiency, reducing processing cost, and small outer diameter
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[0028] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0029] From the above analysis, it can be seen that when using the sleeve 9 to sample the sapphire crystal ingot 1, it is first necessary to cut out the processing plane 7 on the sapphire crystal ingot 1; The cutting loss 8 of the hungry sleeve produced on the above is relatively large; and in order to make the sapphire crystal ingot after taking out use the follow-up processing requirements, it is necessary to perform a secondary cutting operation on the sapphire crystal ingot. When sapphire crystal ingots are used, a large amount of sapphire crystal ingots will be wasted, the yield of rods is low, the cutting accuracy is low, and the use cost is high.
[0030] In order to avoid defects when the existing sapphire crystal ingots are taken, the method for improving the yield of the rods for the sapphire crystal ingots 1 includes the following steps:
[0031] a....
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