Touch panel

Abstract

The invention relates to a touch panel, which comprises a first substrate, a second substrate and a third substrate, wherein the first substrate comprises a first side which has a first circuit; the second substrate comprises the other side which is arranged on the first side of the first substrate and a second side which has a second circuit; and the third substrate is arranged on the second side of the second substrate. According to a structure of the touch panel, the substrates of the touch panel can be integrated, so the aim of reducing the overall thickness of an electronic device is fulfilled.

Description

technical field [0001] The invention relates to a touch panel, in particular to a capacitive touch panel. Background technique [0002] In traditional capacitive touch panels, in addition to liquid crystals and color filters, the touch circuit needs to have at least one additional glass substrate. There are strip-shaped ITO on both sides of the glass substrate, and the ITO on the upper and lower layers is vertical. configuration, on one side of the glass substrate is formed with metal leads, such as figure 1 shown. The formation of ITO electrodes and metal wires is the most important key factor affecting the production cost and quality in the process of forming the touch panel. [0003] figure 2 Shows the traditional method of fabricating the touch circuit in the touch panel. The traditional method is to form a circuit by means of wet etching. First, the glass substrate with ITO formed on both sides is cleaned, and a photoresist is coated on the ITO on the first side of...

AI Technical Summary

Problems solved by technology

[0006] Due to the demand for thin, light and small electronic devices, many palm-sized electronic devices require a thinner overall thickness for portability, and the traditional wet etching method increases the difficulty of integrating substrates

In summary, the traditional method of wet etching to form circuits on glass substrates with ITO is not only time-consuming and labor-intensive, but also increases the overall thickness of electronic devices. Therefore, a process that can integrate component substrates is urgently needed

[0007] In addition, due to the contamination particles that may exist on each substrate, the air bubbles that may be caused by substrate bonding, and the alignment problems of substrate bonding will affect the yield of electronic devices, and the larger the contact area, the greater the bonding accuracy. The higher the difficulty, therefore, there is an urgent need for a process structure that can reduce the demand for substrates in touch panels

Images