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microrelief structure

A micro-relief and relief technology, applied in application, coating, printing and other directions, can solve the problems of difficulty in maintaining relief, damage to relief patterns, and mechanical thermoplastic damage of relief.

Inactive Publication Date: 2015-11-25
OPTAGLIO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during further mechanical (embossing, embossing) processing or, for example, lamination at relatively high temperatures, especially in the case of thermoplastic materials, there may be Maintaining relief is a common difficulty when there is a danger that the relief pattern may be damaged as such
[0003] Embedding diffractive reliefs into materials like polycarbonate has become a long-standing practice since any known lamination technique can completely wipe out diffraction or similar micro-reliefs due to diffraction index matching or due to mechanical and / or thermoplastic failure of the relief. question

Method used

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Embodiment Construction

[0030] It will be appreciated that a particular aspect of the present invention relates to the provision of a "fixed" micro-relief structure which is readily provided in a discrete and independent manner within a body such as a thermoplastic substrate.

[0031] In embodiments of the invention such as those shown in the embodiments, it will be appreciated that preferably the substrate is arranged to comprise at least one substrate layer, for example a thermoplastic layer, or any other suitable material such as PET, wherein the embossed A micro- or nano-scale relief structure is formed, which is subsequently covered with an extremely thin conductive film / layer. The layer may be formed continuously, covering the surface of the thermoplastic substrate, or alternatively, may be patterned or otherwise arranged to retain / cover only selected portions of the substrate. The extremely thin conductive layer is substantially thinner than the height of the relief, thus minimizing the impact...

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Abstract

The present invention provides a method of forming a relief pattern as part of a layered structure and comprising, forming a relief pattern on the surface of a layer of the said structure and subsequently forming a protective fixing layer on at least part of the said relief pattern and serving to protect the underlying relief pattern during any subsequent processing of the said structure, and thereby also provides for a layered structure, generally comprising a substrate having a relief pattern formed on a surface of the substrate and wherein at least a portion of the said relief has been provided with a protective fixing layer serving to retain the characteristics of the relief pattern during any subsequent processing of the structure such as, for example, when forming a laminate structure with the relief pattern provided therein.

Description

technical field [0001] The present invention relates to microrelief structures, structures employing embedded films, and methods of their manufacture. Background technique [0002] There are various techniques for embossing microscale or even nanoscale relief into various materials. However, during further mechanical (embossing, embossing) processing or, for example, lamination at relatively high temperatures, especially in the case of thermoplastic materials, there may be Maintaining relief is a common problem when there is a danger that the relief pattern may be damaged as such. [0003] Embedding diffractive reliefs into materials like polycarbonate has become a long-standing practice since any known lamination technique can completely wipe out diffraction or similar micro-reliefs due to diffraction index matching or due to mechanical and / or thermoplastic failure of the relief. question. [0004] In cases where the security holographic information is embedded or buried...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B3/30B42D25/324
CPCB42D15/00B05D5/00B05D5/06B32B3/08B32B7/12B32B27/08B32B27/36B32B2255/10B32B2255/205B32B2307/206B32B2307/40B32B2307/50B32B2307/75B32B2425/00B42D25/328B42D25/45B42D25/46B42D2033/10B42D2033/30B42D2033/46H05K3/00Y10T428/24521Y10T428/24612B32B3/30G02B5/18G02B5/32B42D25/23B42D25/324B42D25/435
Inventor 尹戈尔·杰拉莫拉杰夫利波尔·科塔克卡托马斯·特塔尔罗伯特·德沃拉克
Owner OPTAGLIO