microrelief structure
A micro-relief and relief technology, applied in application, coating, printing and other directions, can solve the problems of difficulty in maintaining relief, damage to relief patterns, and mechanical thermoplastic damage of relief.
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[0030] It will be appreciated that a particular aspect of the present invention relates to the provision of a "fixed" micro-relief structure which is readily provided in a discrete and independent manner within a body such as a thermoplastic substrate.
[0031] In embodiments of the invention such as those shown in the embodiments, it will be appreciated that preferably the substrate is arranged to comprise at least one substrate layer, for example a thermoplastic layer, or any other suitable material such as PET, wherein the embossed A micro- or nano-scale relief structure is formed, which is subsequently covered with an extremely thin conductive film / layer. The layer may be formed continuously, covering the surface of the thermoplastic substrate, or alternatively, may be patterned or otherwise arranged to retain / cover only selected portions of the substrate. The extremely thin conductive layer is substantially thinner than the height of the relief, thus minimizing the impact...
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