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Chip LED detection device

An inspection device and wafer-type technology, which is applied in the directions of measuring devices, testing optical properties, instruments, etc., can solve the problem of no divergence, etc., and achieve the effect of simple and correct judgment.

Active Publication Date: 2012-01-11
第一实业视检系统股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] In addition, in addition to the above-mentioned types of chip-type LEDs, there are also types in which the inside of the substrate is entirely made of opaque resin or other materials, but there is no difference in the brightness of the electrode part or light-emitting part.

Method used

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Examples

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Embodiment Construction

[0040] An embodiment of the present invention will be described in detail below with reference to the drawings.

[0041] Such as figure 1As shown, the chip-type LED (CHIP LED) inspection device 1 of this example includes a transparent plate-shaped support member 5 carrying the inspection object chip-type LED 50. The surface side image camera 6 of LED 50 is set at the lower position of the support member 5 (in this example, the inside of the support member 5). The illuminating mechanism 15 facing the camera 6 under the visor 10 , and the judging unit 8 judging whether the chip LED 50 is good or bad by analyzing images captured by the camera 6 .

[0042] The inspection object object chip type LED50 of this example is a kind of product with the style shown in Fig. 4 described above.

[0043] The material of the supporting member 5 is not limited as long as it is glass or the like that does not bend and transmits light, and its style may be a flexible thin plate in addition to ...

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Abstract

The invention provides a chip LED detection device, which is a detection device capable of detecting defects of sealed resin portions of chip LEDs. The detection device comprises a transparent pate-shaped or thin plate-shaped support portion for supporting a chip LED, a camera which is configured above the support portion to shoot images of the surface of the chip LED, a shading plate which is disposed below the support portion to clamp the support portion and is opposite to the camera, and an illuminating mechanism below the shading plate. The shading plate is at least larger than the chip LED. The illuminating mechanism illuminates the sealed resin portion of the chip LED through the support portion from the outer side of the shading plate. The chip LED detection device of the invention allows the chip LED images shot by the camera to be set as dark images, and is capable of making an analysis of the obtained images and determining, in a simple and accurate manner, whether defects exist.

Description

technical field [0001] The present invention relates to an inspection device for detecting defects such as scratches and cracks on the sealing resin portion of a chip-type LED. Background technique [0002] There are many styles of chip LEDs, one of which is as Figure 4(a) , 4(b) , 4(c) shown. [0003] As shown in FIG. 4, the chip-type LED 50 consists of a light-transmitting substrate 51, two or more non-light-transmitting electrode portions 52 formed in a state separated from each other inside the substrate 51, and arranged between the 52 and the The light emitting portion 53 at the center of the surface of the substrate 51 and the translucent sealing resin 54 covering the surface of the substrate 51 and sealing the light emitting portion 53 are constituted. [0004] The sealing resin 54 is molded into a convex curved surface (substantially hemispherical in this example) at the portion covering the light emitting portion 53. In addition to the above-mentioned function of...

Claims

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Application Information

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IPC IPC(8): G01N21/956
CPCG01M11/0242G01N21/8806H01L33/54
Inventor 松田晋也佐佐木浩一
Owner 第一实业视检系统股份有限公司