Flat water-cooling heat radiation device

Abstract

The invention discloses a flat water-cooling heat radiation device, which comprises an upper cold plate and a lower cold plate, wherein the top surface of the upper cold plate and/or the bottom surface of the lower cold plate are contacted with a heating device; a plurality of downwards protruded platforms are arranged on the bottom surface of the upper cold plate; a plurality of upwards protruded platforms are arranged on the top surface of the lower cold plate; the lower protruded platforms on the bottom surface of the upper cold plate are staggered with the upper protruded platforms on the top surface of the lower cold plate; a flow channel is formed between the bottom surface of the upper cold plate and the top surface of the lower cold plate; cooling liquid flows in the flow channel so as to take away heat of the upper cold plate and the lower cold plate. According to the flat water-cooling heat radiation device, the manufacturing cost and the manufacturing difficulty can be reduced, and the heat radiation performance is improved.

Description

technical field [0001] The invention relates to a device for dissipating heat by using cooling liquid (such as water). Background technique [0002] see Figure 1a , which is a longitudinal cross-sectional schematic diagram of an existing flat water-cooling heat sink. Figure 1b Yes Figure 1a The middle A-A sectional view is a schematic transverse sectional view of the flat water cooling device. The water-cooling heat dissipation device 10 includes an upper cold plate 11 and a lower cold plate 12, preferably made of metal, and the upper cold plate 11 and the lower cold plate 12 are hermetically bonded at the left and right sides in FIG. 1 . The top surface 11a of the upper cold plate 11 and the bottom surface 12b of the lower cold plate 12 are both flat plates for contacting heating elements. On the bottom surface 11b of the upper cold plate 11, there are a plurality of platforms 110 protruding downward, while the top surface 12a of the lower cold plate 12 is a flat plate...

AI Technical Summary

Problems solved by technology

[0005] see Figure 1a , the experiment found that during the actual use of the above-mentioned flat water cooling device 10, the cooling liquid will flow through the end 110b of the lower boss 110 on the bottom of the upper cold plate, and hardly flow through its root 110a, which will affect its Thermal performance

[0006] In order to improve the heat dissipation performance of the above-mentioned flat water cooling device 10, one approach is to increase the distribution density of the lower bosses 110 on the bottom surface 11b of the upper cold plate, but this poses a higher challenge to the manufacturing process

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