Method for plugging conductive holes of circuit boards by resin

A technology of resin plug holes and conductive holes, which is applied in the direction of the electrical connection of printed components, can solve the problems of unqualified circuit board quality, air bubbles, plug hole depressions, etc., and reduce the chance of plug hole depression and bubbles in holes , reduce the distribution density, improve the effect of quality

Active Publication Date: 2012-02-08
WUXI SHENNAN CIRCUITS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For some circuit boards with a large distribution density of holes, defects such as plug hole depressions and bubbles in the holes are prone to occur after resin plugging, resulting in unqualified circuit board quality

Method used

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  • Method for plugging conductive holes of circuit boards by resin
  • Method for plugging conductive holes of circuit boards by resin
  • Method for plugging conductive holes of circuit boards by resin

Examples

Experimental program
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other Embodiment approach

[0023] In other implementation manners, there may be more grouping methods, as long as the distribution density of each group of conductive holes can be reduced after grouping, which will not be listed here.

[0024] Generally, before grouping the conductive holes opened on the circuit board, it can also include:

[0025] Conductive holes are opened on the circuit board, and copper sinking and electroplating are performed on the circuit board with conductive holes.

[0026] Among them, mechanical drilling or laser drilling can be used to drill holes in the circuit board, and then be processed according to the general copper sinking and electroplating process, so that a layer of metal is attached to the inner wall of the hole to achieve conduction and become a conductive hole.

[0027] After resin plugging the conductive holes, it can also include:

[0028] The excess resin on the surface of the circuit board is polished, copper sinking and electroplating are performed on the ...

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PUM

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Abstract

The embodiment of the invention discloses a method for plugging conductive holes of circuit boards by resin. The method comprises the following steps of: dividing conductive holes formed on the circuit boards into N groups, wherein N is an integer not smaller than 2 and the distribution density of any group of conductive holes is smaller than the distribution density of all conductive holes; and plugging the N groups of conductive holes by resin in sequence. According to the technical scheme of the invention, because the conductive holes are grouped to reduce the distribution density of the conductive holes plugged by resin each time, the difficulty in plugging the conductive holes by resin is reduced, thereby reducing the chance of generating depression and bubbles in holes and improving the quality of resin plugged holes.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a method for resin plugging conductive holes of a circuit board. Background technique [0002] In order to increase the heat dissipation area of ​​the circuit board, the method of electroplating after plugging (POVF) is often used to make the circuit board. The production process generally includes: drilling, copper sinking, electroplating, resin plugging, grinding resin, copper sinking, electroplating, graphics Transfer, and subsequent other processes. [0003] For some circuit boards with a large distribution density of holes, defects such as plug hole depressions and bubbles in the holes are prone to occur after resin plugging, resulting in unqualified circuit board quality. Contents of the invention [0004] The embodiment of the present invention provides a method for resin plugging the conductive holes of the circuit board, which can improve the quality ...

Claims

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Application Information

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IPC IPC(8): H05K3/40
Inventor 黄蕾沙雷管育时刘玉涛卢利斌
Owner WUXI SHENNAN CIRCUITS CO LTD
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