Waterproof dense board

A flat, high-density technology, applied in the field of dense boards, can solve the problems of affecting the bonding effect of wood chips, expensive wood costs, and inconvenient assembly

Inactive Publication Date: 2012-12-19
CHENG TAI FENG TIMBER
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0002] Due to its excellent tactile and visual effects, wood is widely used in various building decoration and furniture materials. However, with the rapid growth of the earth's population, a large amount of natural resources are consumed, and forest logs are affected by a large number of Due to the growing scarcity of felling, the price of wood will increase, and the cost of building decoration and furniture production will be greatly increased. Therefore, based on the above-mentioned shortcomings of too high wood cost, some operators have gradually developed a dense board. Because dense boards are The excess wood fragments after cutting the board are mixed with glue to form, thereby reducing the cost of using logs. However,

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Embodiment Construction

[0026] In order to enable your examiner to have a further understanding and understanding of the purpose, features and effects of the present invention, please cooperate with [Description of Drawings] to describe in detail as follows:

[0027] First, please start by Figure 1 to Figure 3 As shown, a waterproof dense board, the manufacturing process of its waterproof dense board 1 includes the following steps: a rubber mixing molding A and a carbonization treatment process B, wherein the rubber mixing molding A is first penetrated by wood chips The glue is molded to obtain a dense board 10, the wood chips are high-density wood (such as: fir, pine), the dense board 10 is respectively connected with a flat plate 11 on both sides, carbonization treatment procedure B, and then the dense board 10 is placed in a hot pressing device 20, the hot pressing device 20 is an electric furnace, and the heat source can evenly perform a high-temperature baking B1 on the dense plate 10 in a conv...

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Abstract

The invention relates to a waterproof dense board. A manufacturing process of the waterproof dense board comprises the following steps of: rubber mixing molding, wherein bits of wood are formed by an adhesive obtain a dense board; and carbonization processing, wherein the dense board is placed into a hot press which is used for uniformly baking the dense board at a high temperature in a convection manner and drives a packing apparatus to synchronously press and pack the dense board in the high-temperature backing process, and a working temperature of the high-temperature backing process is between 185 DEG C and 250 DEG C, thereby obtaining the waterproof dense board.

Description

technical field [0001] The invention relates to a dense board, especially a waterproof dense board. Background technique [0002] Due to its excellent tactile and visual effects, wood is widely used in various building decoration and furniture materials. However, with the rapid growth of the earth's population, a large amount of natural resources are consumed, and forest logs are affected by a large number of Due to the growing scarcity of felling, the price of wood will increase, and the cost of building decoration and furniture production will be greatly increased. Therefore, based on the above-mentioned shortcomings of too high wood cost, some operators have gradually developed a dense board. Because dense boards are The excess wood fragments after cutting the board are mixed with glue to form, thereby reducing the cost of using logs. However, due to the excellent water absorption of the wood fragments of the dense board, the dense board is easy to be damaged Changes in ...

Claims

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Application Information

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IPC IPC(8): B27N3/02B27N3/20
Inventor 施江山
Owner CHENG TAI FENG TIMBER
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