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Device compatible with earphone interfaces

A headphone jack and compatibility technology, which is applied in the field of devices compatible with headphone jacks, can solve problems such as hardware incompatibility, and achieve the effect of low cost

Active Publication Date: 2015-05-13
SUNYARD SYST ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The invention provides a device compatible with earphone jacks to solve the problem of hardware incompatibility when the order of the microphones and ground wires of two standard mobile terminal earphone jacks is reversed

Method used

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  • Device compatible with earphone interfaces
  • Device compatible with earphone interfaces
  • Device compatible with earphone interfaces

Examples

Experimental program
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Effect test

Embodiment

[0031] image 3 It is a structural block diagram of a compatible earphone interface device provided by a specific embodiment of the present invention; figure 1 As shown, the compatible earphone interface device is composed of an input interface 201, a full bridge circuit 202 and an output interface 203; the input interface 201 includes a tip, a first middle ring, a second middle ring and a terminal; the full bridge circuit 202 has a first input terminal and a second Two input terminals, and a first output terminal and a second output terminal; the output interface 203 includes a left channel, a right channel, a microphone and a ground wire.

[0032] The tip and the first middle ring of the input interface 201 are respectively connected to the left and right channels of the output interface 203; the second middle and end of the input interface 201 are connected to the two input ends of the full bridge circuit 202; the full bridge circuit After the two input terminals of 202 are con...

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Abstract

The invention provides a device compatible with earphone interfaces. The device comprises an input interface, a full bridge circuit and an output interface, wherein the input interface comprises a pointed end, a first middle ring, a second middle ring and a tail end; the output interface comprises a left sound channel, a right sound channel, a microphone and a ground wire; the full bridge circuit comprises a first input end, a second input end, a first output end and a second output end; the second middle ring and the tail end of the input interface are connected with the two input ends of the full bridge circuit; and the microphone and the ground wire of the output interface are connected with the two output ends of the full bridge circuit. By the technical scheme, the input interfaces are reversely connected by using the full bridge circuit, and an output signal is not influenced. The problem that hardware cannot be compatible when microphones and ground wires of mobile terminal earphone interfaces of two standards are reversed in sequence is solved, and the device intelligently compatible with two types of standard interfaces is realized.

Description

Technical field [0001] The present invention relates to the field of electronic technology, in particular to a device compatible with an earphone interface. Background technique [0002] With the continuous innovation and development of technology, the application of mobile terminals has become more and more extensive. Because the shape and electrical performance of the USB interface of mobile terminals of various brands of mobile phones and tablet computers are quite different, and the shape and electrical performance of the earphone interface are the same, it is currently the first choice to use the earphone interface to connect the mobile terminal and the device. [0003] Now mobile terminals such as mobile phones and tablet computers all use 4-segment stereo headphone jacks with microphones, attached figure 1 It is a schematic diagram of a 4-segment stereo headphone jack plug with a microphone in the prior art, such as figure 1 As shown, 101 is the tip of the plug, 102 is the f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R31/06H01R27/00H01R13/66
Inventor 田若征杨斌
Owner SUNYARD SYST ENG CO LTD
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