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Integrated circuit package assembly and method of forming the same

A technology of integrated circuits and packaging components, which is applied in the field of integrated circuit packages and can solve problems such as mismatching and POP structure heat dissipation

Active Publication Date: 2016-05-25
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, POP structures may have thermal (heat) related issues such as heat dissipation or mismatched thermal expansion coefficients due to the different materials used in the combined multiple packages

Method used

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  • Integrated circuit package assembly and method of forming the same
  • Integrated circuit package assembly and method of forming the same
  • Integrated circuit package assembly and method of forming the same

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Embodiment Construction

[0031] The making and using of various embodiments of the invention are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use, and do not limit the scope of the invention.

[0032] In addition, the present invention may repeat reference numerals and / or letters in various instances. This repetition is for the purposes of brevity and clarity only and does not in itself dictate a relationship between the various embodiments and / or structures discussed. Also, the formation of one component on, connected to and / or coupled to another component in the subsequent invention may include embodiments in which the components are formed in direct contact, and may also include embodiments in which intervening components may be formed in an additional component s...

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PUM

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Abstract

An integrated circuit package assembly includes: a first integrated circuit package and a second integrated circuit package disposed below the first integrated circuit package. Solder bumps are disposed between the first integrated circuit package and the second integrated circuit package to provide electrical signal connections between the first integrated circuit package and the second integrated circuit package. At least one support structure is disposed between the first integrated circuit package and the second integrated circuit package to facilitate heat conduction between the first integrated circuit package and the second integrated circuit package without providing electrical signal connections. The invention provides an integrated circuit package assembly and a method for forming the same.

Description

technical field [0001] The present invention relates generally to integrated circuit packages and, more particularly, to package-on-package (POP). Background technique [0002] Package-on-package (POP) is an integrated circuit packaging technology that allows vertical bonding of multiple packages, such as discrete logic and memory ball grid array (BGA) packages. Two or more packages are mounted on top of each other, ie stacked, with electrical interfaces routing electrical signals between them. This allows for higher density integrated circuit chips to be used in mobile devices such as mobile phones or personal digital assistants (PDAs). However, due to the different materials used in the combined multiple packages, the POP structure may have thermal (heat) related issues such as heat dissipation or mismatched thermal expansion coefficients. Contents of the invention [0003] In one aspect, the present invention provides an integrated circuit package assembly, comprising...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/373H01L23/367H01L25/00H01L21/48
CPCH01L2224/16225H01L2224/32145H01L2224/32225H01L2224/73204H01L2224/73253H01L2224/73265H01L2924/15311H01L2924/15321H01L2224/48464H01L2224/29299H01L24/16H01L24/32H01L24/48H01L24/73H01L2224/2929H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/83191H01L2224/94H01L25/105H01L2225/1023H01L2225/1058H01L2225/1094H01L2224/48227H01L2924/181H01L2924/00014H01L24/45H01L2924/00012H01L2924/00H01L2224/27H01L2224/45015H01L2924/207H01L25/0657H01L2225/06513H01L24/11H01L24/81H01L2224/81801
Inventor 陈宪伟
Owner TAIWAN SEMICON MFG CO LTD