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Connection structure for an integrated circuit with capacitive function

A connection structure and capacitive structure technology, which is applied in the direction of circuits, capacitors, electrical components, etc., can solve the problems of increased integrated circuit size cost, capacitive component occupation, etc.

Active Publication Date: 2013-08-14
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] The problem with the above structure is that the capacitive element integrated in the chip occupies most of its substrate, thus increasing the size of the integrated circuit and its cost

Method used

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  • Connection structure for an integrated circuit with capacitive function
  • Connection structure for an integrated circuit with capacitive function
  • Connection structure for an integrated circuit with capacitive function

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Embodiment Construction

[0034]In the following description, for explanatory purposes, specific details are provided in order to allow a clear understanding of the concepts of the invention. It is evident, however, that the present invention may be practiced without these specific details. Also, known structures and components are only described in their general form for easier description of them.

[0035] The problem forming the basis of the present invention is based on the ever-increasing demand for the production of cost-reduced microelectronic components of small size.

[0036] However, the invention is based on the observation that in an integrated circuit or chip, possible capacitive elements are integrated in dedicated areas of the chip and usually when designing an integrated circuit an attempt is made to eliminate parasitic capacitances in the pads in order to avoid changing the pads themselves function. This means that most of the area of ​​the integrated circuit is occupied by very bulk...

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Abstract

The present invention in a single structure combines a pad comprising a connection terminal suitable for connecting the circuit elements integrated in a chip to circuits outside of the chip itself and at least one condenser. By combining a connection pad and a condenser in a single structure it is possible to reduce the overall area of the chip that otherwise in common integrated circuits would be greater due to the presence of the condenser itself. In this way, the costs and size of the chip can be reduced.

Description

technical field [0001] The invention relates to a connection structure with pads containing capacitive elements suitable for use during testing steps of electronic components in substrates and / or as circuit elements in final applications of integrated circuits. The invention also relates to a system comprising a connection structure and one or more circuit elements connected to said connection structure. Background technique [0002] Thanks to advances in the field of integrated electronic circuit manufacturing processes, electronic components are becoming smaller and smaller, thus allowing the manufacture of substrates comprising a large number of integrated circuits. It is also possible to manufacture small electronic circuits comprising a large number of components and thus also greatly increase the density of connection terminals suitable for connecting integrated electronic circuits. The latest generation devices therefore have a large number of terminals or pads to be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/522
CPCH01L2924/0002H01L28/60H01L23/5223H01L28/90H01L2924/00
Inventor A 帕加尼A·帕加尼
Owner STMICROELECTRONICS SRL