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Heater block and a substrate treatment apparatus

A technology for processing equipment and heating blocks, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficult substrate maintenance, uniform temperature, difficult measurement and control of substrate temperature, etc., and achieve high economic feasibility Effect

Active Publication Date: 2013-12-04
AP SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Equipment for rapid thermal processes has so far been unattractive due to difficulty maintaining a uniform temperature across the substrate and between substrates when changing substrates (wafers) - Time characteristic, and it is difficult to measure and control the temperature of the substrate

Method used

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  • Heater block and a substrate treatment apparatus
  • Heater block and a substrate treatment apparatus
  • Heater block and a substrate treatment apparatus

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Embodiment Construction

[0032] Hereinafter, preferred embodiments of a heating block for a rapid heating device according to the present invention will be described in detail with reference to the accompanying drawings. The terms used herein should not be construed restrictively as general meanings or dictionary definitions. According to the rule that the inventor can properly define the concept of the terms to describe the inventor's invention in the best manner, the terms should be construed as having meanings and concepts consistent with the technical spirit of the present invention.

[0033] In the following description, as a substrate processing apparatus that performs heat treatment on a substrate as a target subjected to heat treatment, a rapid thermal apparatus will be exemplified. However, it will be apparent that the present invention is applicable to various substrate processing apparatuses capable of performing heat treatment other than rapid thermal apparatuses.

[0034] figure 1 is a ...

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Abstract

The present invention relates to a heater block and a substrate treatment apparatus, and more particularly to a heater block to perform heat treatment on a substrate and a substrate treatment apparatus having the same. According to embodiments of the present invention, it is provided a heater block for a substrate treatment apparatus having heating lamps on its one side to transfer heat to a target subjected to heat treatment, the heating lamps having different arrangement patterns in a plurality of regions on said one side.

Description

technical field [0001] The present invention relates to a heating block and a substrate processing apparatus, and more particularly, to a heating block for performing heat treatment on a substrate and a substrate processing apparatus having the heating block. Background technique [0002] Heat treatment is a necessary procedure in the semiconductor process, and it is ohmic contact alloying, ion-implantation damage annealing, dopant activation, film formation (TiN, TiSi 2 、CoSi 2 ) and so on as required. [0003] Such heat treatment may be performed using equipment such as furnaces and rapid thermal process (RTP) equipment. Equipment for rapid thermal processes has so far been unattractive due to difficulty maintaining a uniform temperature across the substrate and between substrates when changing substrates (wafers) - time characteristic, and it is difficult to measure and control the temperature of the substrate. However, recent advances in temperature measurement and c...

Claims

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Application Information

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IPC IPC(8): H01L21/324H01L21/67
CPCH01L21/67115H01L21/22H01L21/324
Inventor 金昌敎金圣澈权昶珉金奇南
Owner AP SYST INC
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