Package for housing electronic components and electronic device

A technology of electronic components and electronic devices, applied in the direction of circuit heating devices, printed circuit components, electrical components, etc., can solve the problems of difficult heat dissipation, difficult correction of substrate bending, easy deformation of screw fixing parts, etc., to achieve easy heat dissipation and increased area Effect
CN104067385BInactive Publication Date: 2017-02-22KYOCERA CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
KYOCERA CORP
Publication Date
2017-02-22
Estimated Expiration
Not applicable · inactive patent

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Abstract

The package (10) is provided with: a case (1), which mounts an electronic component (5) in a recess (1a) having an opening on the upper surface; and a screw fixing part (31), which is fixed to the case The side of the body (1) and extends towards the side. The screw fixing part (31) has: a thin-walled part (34), which is arranged on the front end side and has a through hole (36) for installing screws; a thick-walled part (35), which is arranged on the thin-walled part (34) and Between the side surfaces of the casing (1), the thickness of the thick-walled portion (35) is thinner than the thickness of the side surface of the casing (1) and thicker than the thickness of the thin-walled portion (34); and the holes for screw connection ( 37), it is arranged on the thick wall part (35) along the up and down direction. Even if the case (1) is bent when the package (10) is fixed to the external substrate, heat dissipation from the package to the external substrate can be improved.
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Description

technical field

[0001] The present invention relates to a package for housing electronic components and an electronic device. Background technique

[0002] As an electronic component storage package (it may only be called a package hereinafter) which accommodates an electronic component, the package described in patent document 1 is known, for example. The package described in Patent Document 1 includes screw fixing portions at four corners for mounting the substrate to the external substrate.

[0003] In the package described in Patent Document 1, a stepped portion in which an upper surface on the side of the screw fixing portion is lowered is formed between a portion of the base body to which the case is joined and the screw fixing portion. The thickness of the screw fixing portion formed at the tip of the stepped portion becomes thin. Therefore, when the package is mounted on the external substrate using screws, the screw fixing portion is easily deformed.

[0004] pri...

Claims

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