A kind of manufacturing method of perlite light-weight environment-friendly plate

A manufacturing method, perlite technology, applied in the direction of sustainable waste treatment, solid waste management, climate sustainability, etc., can solve the problems of large shrinkage of puffed perlite board, high water absorption, board surface deformation, etc., to achieve the shape Good stability, small natural deformation, high fire rating

Active Publication Date: 2016-09-14
广州市德盛技术开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to overcome the problems of edge collapse, high brittleness, and deformation of the board surface in the prior art and the shortcomings of expanded perlite boards such as large shrinkage, high water absorption, and low strength, and provides a pearlite Manufacturing method of rock light environmental protection plate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The manufacturing method of described perlite light-weight environment-friendly plate comprises the steps:

[0030](1) Continuously dry circuit board powder and puffed perlite fine powder separately: when drying circuit board powder, control the drying temperature in the drying room at about 160°C, and control the moisture content of the dried circuit board powder to about 10%; puffed pearl The rock fine powder is dried in a pipeline, and the drying temperature in the drying pipeline is controlled to be about 120°C, and the moisture content of the dried expanded perlite fine powder is controlled to be 5%-6%;

[0031] (2) Uniformly and continuously atomize the dried circuit board powder to apply adhesive, and the weight of the applied adhesive is 6%-16% of the weight of the circuit board powder; uniformly and continuously spray the dried expanded perlite fine powder Continuously atomize and apply the mixture of adhesive and waterproofing agent, the weight of the applied ...

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PUM

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Abstract

The invention discloses a manufacturing method of a perlite light environment-friendly panel. The manufacturing method comprises the steps of respectively drying circuit board powder and puffed perlite fine powder, applying an adhesive, mixing, paving in a layered manner, performing hot-pressing molding on a pre-pressed slab, trimming and the like. According to the method, the circuit board powder and puffed perlite fine powder are utilized to enable the density of the light environment-friendly panel to be about 500-650 Kg / m<3>, and the actual recycle utilization can be realized; the circuit board powder does not absorb water and is high in ignition point, and the puffed perlite fine powder is excellent in heat preservation property and light in weight, so that the novel light environment-friendly panel has the advantages of being good in waterproof performance and heat preservation property, high in fireproof grade, high in mechanical strength, high in elasticity, good in morphological stability and the like; the difficulties of edge breakage, high brittleness, panel surface deformation and the like in the prior art and the defects that a puffed perlite plate is large in contractility, high in water absorption rate, low in strength and the like in the prior art are overcome, and the problem that the circuit board powder and puffed perlite fine powder pollute the environment is solved.

Description

technical field [0001] The invention relates to a method for manufacturing a perlite light-weight environment-friendly plate. In particular, the circuit board powder and puffed perlite fine powder are used to manufacture lightweight, waterproof, fireproof, heat-insulating, sound-insulating and environmentally friendly boards. Background technique [0002] With the rapid development of social economy, the electronic manufacturing industry is developing at an astonishing speed, and the updating speed of electronic products is accelerating. According to the report released by the United Nations Environment Program in 2010, my country has become the second largest producer of electronic waste in the world. Produce more than 2.3 million tons of electronic waste, second only to the 3 million tons in the United States; by 2020, my country's waste computers will double to quadruple compared to 2010, and waste mobile phones will increase by 7 times. Waste printed circuit board is a m...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C04B26/16C04B26/10C04B26/12C04B18/04C04B14/18
CPCY02W30/91
Inventor陈烽锋
Owner广州市德盛技术开发有限公司