Layered distribution short-fiber reinforced porous phenolic composite material and preparation method thereof

A technology of short fiber reinforcement and composite materials, which is applied in the field of phenolic resin composite materials and its preparation, can solve the problems of high thermal conductivity, density, and limitation, and achieve the effects of uniform tissue composition, low density, and low cost

Active Publication Date: 2015-11-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in aviation, aerospace and other high-tech fields that have special requirements for quality and heat insulation performance, the existing phenolic resin and its composite materials are limited due to relatively high thermal conductivity and density.

Method used

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  • Layered distribution short-fiber reinforced porous phenolic composite material and preparation method thereof
  • Layered distribution short-fiber reinforced porous phenolic composite material and preparation method thereof
  • Layered distribution short-fiber reinforced porous phenolic composite material and preparation method thereof

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specific Embodiment approach 1

[0022] Specific Embodiment 1: In this embodiment, the layered distributed short fiber reinforced porous phenolic composite material is composed of 20% to 80% phenolic resin and the rest of short fibers according to the mass percentage; the short fibers are distributed in the layered short fiber reinforced porous phenolic composite material Medium-layered distribution, layered distribution A large number of nanopores or micron-sized pores are evenly distributed in the short fiber reinforced porous phenolic composite material.

specific Embodiment approach 2

[0023] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the short fibers are glass fibers, high silica fibers or carbon fibers with a length of 0.5-10 mm. Others are the same as the first embodiment.

specific Embodiment approach 3

[0024] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the layered distributed short fiber reinforced porous phenolic composite material consists of 30% to 70% phenolic resin and the rest of short fibers by mass percentage. Others are the same as the first embodiment.

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Abstract

The invention provides a layered distribution short-fiber reinforced porous phenolic composite material and a preparation method thereof, and relates to a phenolic resin composite material and a preparation method thereof. The material and the method solve the problem of high heat conductivity and large density of current phenolic resin and a composite material thereof. The porous phenolic composite material consists of phenolic resin and short fibers. The preparation method comprises the steps of (1) preparing a phenolic resin solution; (2) adding the short fibers to obtain a sizing agent; (3) injection moulding and pressing; (4) solidifying. The layered distribution short-fiber reinforced porous phenolic composite material provided by the invention has the characteristics of low density and low heat conductivity.

Description

technical field [0001] The invention relates to a phenolic resin composite material and a preparation method thereof. Background technique [0002] Phenolic resin and its composite materials are widely used in many important technical and economic fields because of their excellent heat resistance, flame retardancy and dimensional stability, as well as good processability, chemical resistance and low price. However, in aviation, aerospace and other high-tech fields that have special requirements for quality and heat insulation performance, the existing phenolic resin and its composite materials are limited due to relatively high thermal conductivity and density. Contents of the invention [0003] The object of the present invention is to provide a layered distributed short fiber reinforced porous phenolic composite material and its preparation method in order to reduce the thermal conductivity and density of the existing phenolic resin and its composite material. [0004] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08K7/14C08K7/10C08K7/06B29C70/42
Inventor 程海明薛华飞洪长青张幸红韩杰才
Owner HARBIN INST OF TECH
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