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A miniature radiator with a columnar phyllotaxy structure

A heat sink and columnar technology, applied in the field of micro heat sinks, can solve the problems of inability to adopt heat dissipation methods and reduce heat dissipation space, so as to achieve the effect of improving service life and working efficiency and reducing surface temperature

Inactive Publication Date: 2018-01-02
SHENYANG LIGONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These are currently unable to meet the needs of stable operation of electronic components, especially with the reduction of the internal heat dissipation space of components or electronic equipment, it is no longer possible to use conventional heat dissipation methods, and the structure of the radiator must be changed to improve the performance of electronic components. cooling capacity

Method used

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  • A miniature radiator with a columnar phyllotaxy structure
  • A miniature radiator with a columnar phyllotaxy structure
  • A miniature radiator with a columnar phyllotaxy structure

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Embodiment Construction

[0034] A micro-radiator with a columnar phyllotaxy arrangement structure is composed of a heat dissipation bottom plate 14, a main heat dissipation column 15 and a plurality of secondary heat dissipation columns 16, and is characterized in that:

[0035] The main heat dissipation column 15 is vertically fixed on the square heat dissipation bottom plate 14 with a height of 3 mm, and the axis of the main heat dissipation column 15 coincides with the central point of the heat dissipation bottom plate 14 . The lower ends of a plurality of secondary cooling columns 16 are fixedly connected to the outer circular surface 17 of the main cooling column 15 respectively, and a plurality of secondary cooling columns 16 are arranged on the outer surface of the main cooling column 15 according to the Van Iterson model, and the model is , , , . That is, under the column scale, n is the arrangement ordinal number of heat dissipation columns, for the first n The polar coordinate rad...

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Abstract

The invention relates to a micro radiator with a cylindrical phyllotaxy arrangement structure, and the micro radiator is formed by a heat-dissipating base plate, a primary heat-dissipating column and a plurality of secondary heat-dissipating columns. The micro radiator is characterized in that: the primary heat-dissipating column is fixed to the heat-dissipating base plate, the lower ends of a plurality of secondary heat-dissipating columns is respectively and fixedly connected with the cylindrical surface of the primary heat-dissipating column, and the arrangement of a plurality of secondary heat-dissipating columns on the cylindrical surface of the primary heat-dissipating column satisfies the Van Iterson model of the phyllotaxy theory in the biological science. According to the invention, the heat-dissipating area is increased, and the heat-dissipating efficiency is improved.

Description

technical field [0001] The invention relates to a heat sink, in particular to a micro heat sink with a columnar phyllotaxy arrangement structure, which can effectively reduce the surface temperature of electronic components. Background technique [0002] With the continuous improvement of the integration and performance of electronic components and the continuous reduction of its physical size, the heat flux of electronic components has increased sharply, and its surface heat flux is as high as ~ The heat dissipation problem has become one of the main factors restricting the performance improvement of microelectronic components and equipment, and has become one of the important research directions in the field of fluid mechanics and heat transfer. Conventional radiators use aluminum or copper plate-fin radiators and pin-column radiators, and the way of adding fans relies on the forced convection heat transfer method of single-phase fluid. These are currently unable to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H05K7/20
Inventor 吕玉山王军舒启林胡玉珩
Owner SHENYANG LIGONG UNIV