A method of preparing a conductive metallic layer or pattern

A conductive metal layer, metal layer technology, applied in the formation of conductive patterns, improvement of metal adhesion of insulating substrates, conductive coatings, etc.

Active Publication Date: 2016-02-17
AGFA GEVAERT AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Organic components of metal printing or coating fluids such as polymeric dispersants or capping agents can reduce sintering efficiency and thus reduce the conductivity of the applied pattern of the layers

Method used

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  • A method of preparing a conductive metallic layer or pattern
  • A method of preparing a conductive metallic layer or pattern
  • A method of preparing a conductive metallic layer or pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0192] Preparation of silver nanoparticle dispersion NPD-01

[0193] 576.0 g of 2-pyrrolidone, 576.0 g of ethanol and 1728.0 g of YTZ beads were added to a 2 liter PE container. To this mixture was added 320.0 g of silver oxide (from Umicore). The closed container was then placed on a "roller mill" for 24 hours. After removal of the YTZ beads, a predispersion was obtained.

[0194] 44.26 ml of formic acid was added to the predispersion at 22°C (1.25 mL / min). The mixture was then stirred overnight at 22°C. The mixture was then filtered using a 60 μm filter cloth. The filtrate was then concentrated at 40° C., first at 110 mbar for 60 minutes and then at 60 mbar for 30 minutes.

[0195] The resulting silver nanoparticle dispersion NPD-01 had ± 20% by weight of silver relative to the total weight of the dispersion.

Embodiment 2

[0197] The silver nanoparticle dispersion NPD-01 and the dispersion obtained by first diluting the dispersion with a 50 / 50% by weight mixture of 2-phenoxyethanol / 2-methylpyrrolidone were subsequently coated on polyester ( Blade coater, the coating thickness is 10 μm), to obtain coating layers CL-01 and CL-02.

[0198] CL-01 and CL-02 were subsequently subjected to multiple treatments: drying, application of an overcoat of 1% HCl solution on top of the coating, and curing in the order shown in Table 2.

[0199] The surface resistance (SER) of the coatings after different treatments of the coatings was measured using a four-point collinear probe. The surface or sheet resistance is calculated by the following formula:

[0200] SER=(π / ln2)*(V / I)

[0201] in:

[0202] SER is the surface resistance of the layer, expressed in Ω / □;

[0203] π is a mathematical constant, approximately equal to 3.14;

[0204] ln2 is a mathematical constant equal to the natural logarithm of the valu...

Embodiment 3

[0218] Preparation of Silver Nanoparticle Dispersion NPD-02

[0219] While stirring, 78.0 g of silver oxide was slowly added to the 1 L reactor containing 275.0 g of valeric acid and 401.0 g of 2-pyrrolidone. The temperature of the mixture was maintained at 25°C.

[0220] After the silver oxide addition was complete, the suspension was stirred overnight at 25°C.

[0221] Subsequently, 300.0 g of N,N-diethylhydroxylamine were added to the suspension over a time span of 1.5 hours. The temperature of the reaction mixture was maintained at 25 °C. When all the reducing agent had been added, the reaction was kept at 25°C while stirring for an additional 1 hour.

[0222]The reaction mixture was then fed into a settling vessel where it was kept overnight without stirring. Carefully remove the supernatant from the pellet.

[0223] The resulting sediment was washed four times: with DowanolPM TM (547g) washed twice and with butylcellosolve TM (547g) was washed twice. In each wash...

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Abstract

A method of preparing a conductive metallic layer or pattern comprising the steps of: - applying a metallic nanoparticle dispersion on a support to obtain a metallic layer or pattern, - contacting the metallic layer or pattern with a solution containing an acid or an acid precursor capable of releasing the acid during curing of the metallic layer or pattern. It has been observed that by contacting the metallic layer or pattern with a solution containing an acid or an acid precursor capable of releasing the acid, higher conductivities at moderate curing conditions are obtained.

Description

[0001] describe. field of invention [0002] The present invention relates to a method for preparing highly conductive patterns or coatings from metal nanoparticle dispersions under mild curing conditions. Background of the invention [0003] During recent decades, interest in printing or coating fluids containing metal nanoparticles has increased due to the unique properties of such metal nanoparticles when compared to the bulk properties of a given metal. For example, the melting point of metal nanoparticles decreases with particle size, making them attractive for printed electronics, electrochemical, optical, magnetic, and biological applications. [0004] The production of stable and concentrated metal printing or coating fluids that can be printed, for example by inkjet printing or screen printing, or coated at high speeds is of great interest due to their ability to produce electronic devices at low cost. [0005] Typically, metal nanoparticles are prepared by polyol...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K1/09H05K3/12H05K3/38
CPCH05K1/097H05K3/1208H05K3/1283H05K3/386H05K2203/1131B05D1/42B05D3/007B05D3/107C09D5/24
InventorD.博里恩N.维里亚蒙特
OwnerAGFA GEVAERT AG