The invention discloses
wafer rough
polishing liquid based on a nano-particle dispersion technology and a preparation method thereof. The preparation method comprises the following steps: S1,
surface modification of nano
abrasive particles; s2, preparing a
polishing solution; s3, a third-stage dispersion process; s4, carrying out online monitoring and regulation; and S5, filtering and packaging. The core-shell three-layer structure composite
abrasive particle is adopted for the nano
abrasive particle, the inner layer is high-
hardness mechanical
grinding, the middle layer is used for buffering
impact and enhancing dispersion, the outer layer is used for accelerating oxidation reaction, the
grinding efficiency and uniformity are improved, the composite dispersing agent ensures stable dispersion of the nano particle through the dual mechanisms of electrostatic repulsion and steric hindrance, agglomeration is avoided, and the
wear resistance of the nano particle is improved. During dispersion, high-energy ball milling, high-shear emulsification,
ultrasonic cavitation and
magnetic field assistance are combined, aggregates are effectively crushed, abrasive particles are refined,
dispersion stability is enhanced, accurate parameters such as particle size, potential and
viscosity are ensured through online monitoring and regulation, the performance of the
polishing solution is improved through the whole process, and the
wafer polishing quality and efficiency are guaranteed.