Synthesis of Metallic Nanoparticle Dispersions

a technology of nanoparticles and dispersions, applied in the field of nanoparticles, can solve the problems of limiting the processing of flake-based inks, unable to achieve conductivities of only 2 to 10% of bulk metal conductivity, and the current method of printing conductive compositions onto substrates has certain limitations
US20070144305A1Inactive Publication Date: 2007-06-28PCHEM ASSOC
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Patent Information

Authority / Receiving Office
US ¡ United States
Patent Type
Applications(United States)
Current Assignee / Owner
PCHEM ASSOC
Publication Date
2007-06-28
Estimated Expiration
Not applicable ¡ inactive patent

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Abstract

Disclosed are compositions comprising metallic nanoparticles suitable for use in cohesive, highly conductive structures on substrates. Also disclosed are methods for synthesizing the compositions and methods for forming cohesive, highly conductive structures from the compositions.
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Description

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Pat. App. No. 60 / 752,143, “Low Temperature Curing Inks Utilizing Metallic Nanoparticles As A Sintering Aid”, filed Dec. 20, 2005, U.S. Provisional Pat. App. No. 60 / 752,144, “Low Temperature Curing Inks Containing Metallic Nanoparticle Dispersions”, filed Dec. 20, 2005, and U.S. Provisional Pat. App. No. 60 / 752,628, “Capacitance Coupled Interactive Electronics Using Printed Conductors”, filed Dec. 21, 2005. The entirety of each of these applications is incorporated by reference herein in their entirety.FIELD OF THE INVENTION

[0002] The present invention pertains to the field of nanoparticles. The present invention also pertains to the fields of conductive inks and of printable conductive features. BACKGROUND OF THE INVENTION

[0003] Various scientific and patent publications are referred to herein. Each is incorporated by reference in its entirety.

[0004] Thin, conductive metal films...

Claims

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