Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Alstroemeria root growth promoting method

A root method and flower seedling technology, applied in the field of plant root promotion, can solve the problems of perishability, low germination rate, low reproduction coefficient, etc., achieve the effect of increasing reproduction coefficient, improving survival rate, and solving perishability

Inactive Publication Date: 2016-02-24
JIANGSU POLYTECHNIC COLLEGE OF AGRI & FORESTRY
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the method of the prior art can reproduce, it is perishable after the division, and the germination rate is not high, resulting in a very low reproduction coefficient

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Alstroemeria root growth promoting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] (1) Select a robust Alpinia japonica plant, and divide the plants on October 1. When dividing the plants, the number of buds retained in each segment is 2 old buds, and the incision is dipped in lime powder.

[0022] (2) Choose yellow jersey sawdust, expose the sawdust to the sun for 2 days, bury the seedlings after division in step (1) in the sawdust matrix, and cultivate the Alpinia japonica seedlings separately on November 1.

Embodiment 2

[0024] (1) Select a robust Alpinia japonica plant, and divide the plants on October 10. When dividing the plants, the number of buds retained in each segment is 3 old buds, and the incision is dipped in lime powder.

[0025] (2) Select hemlock sawdust, and expose the sawdust to the sun for 3 days, bury the seedlings after division in step (1) in the sawdust substrate, and cultivate the alpinia seedlings separately on November 10.

Embodiment 3

[0027] Take the same batch of Alpinia officinalis plants, adopt 4 different substrates to cultivate Alpinia officinalis ramets, design a comparative experiment, and the rest of the steps are the same as in Example 1.

[0028] Table 1 Comparison table of performance of flower seedlings obtained by cultivating Alt.

[0029]

[0030] It can be seen from Table 1 that the effect obtained by using sawdust substrates to cultivate the ramet seedlings of Alpacia japonica is better than that of other substrates. High rate. This is because when the sawdust substrate is used, on the one hand, after the substrate is exposed to the sun, a large number of germs are killed to ensure that the infection of germs is reduced during treatment; second, because the sawdust contains certain organic nutrients, it can supply certain nutrients to the plants. ; The third sawdust is loose and breathable, which is beneficial to the respiration and growth of the root system, and the sawdust is easier to...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses an alstroemeria root growth promoting method. The method comprises the following steps: (1) selecting a healthy and strong alstroemeria plant, and dividing the plant; and (2) burying a seedling obtained after plant division in the step (1) into sawdust substrates, and culturing the alstroemeria seedling in another manner after one month. According to the alstroemeria root growth promoting method provided by the present invention, the root is cultured by using the sawdust substrates, therefore, the problem that the alstroemeria is easy to rot after plant division is effectively solved, rotting phenomena are reduced, the survive rate of ramets is improved, and the proliferation coefficient of the alstroemeria is increased.

Description

technical field [0001] The invention relates to a root-promoting method for plants, in particular to a root-promoting method for alpinia officinalis. Background technique [0002] Alternaria, also known as Chilean lily, Peruvian lily, and narcissus lily, is a plant of the genus Alpinia in the family Aloeaceae. Alpacia has rich colors and strange flower shapes, and is more elegant and rich when it is in full bloom. It is a novel cut flower material. In recent years, it has begun to be used in potted ornamental plants. [0003] Alpacia is still in the stage of introduction in my country, and it is still rare in the cut flower market, and only a few enterprises have carried out small-scale trial planting. Potted alstroemeria is only exhibited at the exhibition, and cut flower varieties are used. For this reason, potted alpinia officinalis is still a blank in my country and has a better development prospect. There are three main methods of propagation of alpinia officinalis,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): A01G1/00
Inventor 周余华刘玉华王磊王红梅
Owner JIANGSU POLYTECHNIC COLLEGE OF AGRI & FORESTRY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com