Water draining device for chemical copper equipment
A drainage device, chemical copper technology, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of drainage ball valve copper stuck, dismantling and updating, inoperable and so on
Active Publication Date: 2016-03-02
SUZHOU TOP CREATION MACHINES
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Problems solved by technology
[0004] However, the above-mentioned device has the following defects: because the gas stirring will only produce a stirring effect in a small range near the gas outlet, and the part without gas stirring, the copper solution is still in a static state, which will still cause copper accumulation on the drain ball valve for a long time Stuck and unable to operate, the update must be removed
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[0022] The technical solution in the embodiment will be specifically, clearly and completely described below in conjunction with the drawings in the embodiment.
[0023] see Figure 3-4 As shown, the embodiment of the present invention discloses a drainage device for chemical copper equipment, which is installed at the drainage place of chemical copper equipment. The drainage device includes an adjustment mechanism 1, a pressing mechanism 2 and a base 6, and the pressing mechanism 2 Located in the liquid medicine tank A, the adjusting mechanism 1 is connected with the pressing mechanism 2, and the adjusting mechanism 2 is intermittently opened or closed with the base 6. The road 3 is connected with the drain ball valve 4, and the closed pipeline 3 is connected with the external pipeline 5, and the external pipeline 5 is used for injecting pure water into the closed pipeline 3.
[0024] Wherein, the adjustment mechanism 1 includes a fixed seat 11, an adjustment handle 12, a va...
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The invention discloses a water draining device for chemical copper equipment. The water draining device is installed at the water draining position of the chemical copper equipment. The water draining device comprises an adjusting mechanism, a compressing mechanism and a base. The compressing mechanism is located in a processing solution tank. The adjusting mechanism is connected with the compressing mechanism and adjusts the compressing mechanism and the base to be in an opened state or in a closed state intermittently. The interior of the base is of a through structure, and the base is connected with a water draining ball valve through a section of closed pipeline. The closed pipeline is communicated with an external pipeline, and the external pipeline is used for pouring pure water into the closed pipeline. According to the water draining device for the chemical copper equipment, the compressing mechanism and the base are made to be compressed and locked through the adjustment of the adjusting mechanism, so that the closed pipeline is formed between a processing solution in the tank and the water draining ball valve and is communicated with the external pipeline, water sealing is achieved by pouring the pure water into the closed pipeline through the external pipeline, and therefore it is guaranteed that no processing solution makes contact with the water draining ball valve, and the phenomena of copper coalescing and blocking of the water draining ball valve are avoided.
Description
technical field [0001] The invention relates to chemical copper equipment, in particular to a drainage device for chemical copper equipment, and belongs to the technical field of wet process equipment. Background technique [0002] The chemical copper process is widely used in the production and processing of printed circuit boards with through holes. Its main purpose is to deposit a layer of copper on a non-conductive substrate through a series of chemical treatments, and then thicken it through subsequent electroplating methods. Make it to the specific thickness of the design. The chemical copper process completes the deposition of chemical copper through a series of necessary steps. Because there are some activators in the liquid medicine, the suspended particles settle in the dead corner of the tank wall and pollute the tank body. Therefore, the tank body needs to be pumped and stirred 24 hours a day. . [0003] At present, in the chemical copper process, the method of...
Claims
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Login to View More IPC IPC(8): C23C18/38
CPCC23C18/1621C23C18/38
Inventor 黄品椿
Owner SUZHOU TOP CREATION MACHINES