Leveling and overlaying machine for raw ceramic chip through hole column protrusions

Abstract

The invention discloses a leveling and overlaying machine for raw ceramic chip through hole column protrusions. By the adoption of the leveling and overlaying machine, the problem that when through hole column protrusions are leveled, a guiding rail is prone to being pressed and damaged is solved. The leveling and overlaying machine comprises a rectangular base (1). Four guiding supporting stand columns (2) are arranged on the rectangular base (1). A pressing table fixing plate (3) and a pneumatic oil hydraulic cylinder (4) are fixedly arranged at the top ends of the four guiding supporting stand columns. The four corners of a rectangular upper pressing table (5) are each provided with a linear bearing installing hole (6). A lower pressing table conveying guiding rail (9) is arranged on the portion, on the inner sides of the guiding supporting stand columns, of the rectangular base. The four vertical angles of a lower U-shaped pressing table fixing plate (12) are each provided with a lower pressing table guiding column (13) and a lower pressing table supporting spring (8). A leveling supporting base (8) is arranged on the portion, under the rectangular pressing table, of the rectangular base. The leveling supporting base (8) is lower than the lower bottom face of a top plate of the lower U-shaped pressing table fixing plate (12). According to the leveling and overlaying machine, the structure is simple, materials can be taken and placed conveniently and safely, and the cost performance is high.

Description

technical field [0001] The invention relates to a leveling mechanism, in particular to a mechanism for leveling the bulges of through-hole columns of green ceramic sheets. Background technique [0002] Low-temperature co-fired ceramic production technology is to make low-temperature co-fired ceramic powder into green ceramic tape, slice it into shape, and perform punching, hole grouting, conductor, resistance printing and other processes on the formed green tape to produce the required circuit pattern. , and multiple passive components can be embedded in it, then multi-layer laminated together, sintered at 900 ° C to make a passive integrated component of a three-dimensional circuit network, or a three-dimensional circuit substrate with built-in passive components, IC and active devices can be mounted on its surface to make passive / active integrated functional modules. In the production process, after the metal paste is injected into the through hole in the green ceramic sh...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a green ceramic sheet through-hole column bulging leveling and laminating machine, which solves the technical problem that the guide rail is easily damaged when the through-hole column is bulging and pressing.

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