Semiconductor device and method of forming the same
A semiconductor and device technology, applied in the field of semiconductor devices and their formation, can solve problems such as poor performance of semiconductor devices, achieve the effects of increased etching, improved performance, and enhanced protection
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[0022] As the feature size is further reduced, the performance of semiconductor devices formed in the prior art is poor.
[0023] Figure 1 to Figure 3 It is a structural schematic diagram of the process of forming a semiconductor device in the prior art.
[0024] refer to figure 1 , provide a semiconductor substrate 100, the surface of the semiconductor substrate 100 has a fin 120 and a metal gate structure across the fin 120, the metal gate structure covers part of the top surface and sidewall of the fin 120, the metal gate The pole structure includes a gate dielectric layer 131 across the fin portion 120 and an initial metal gate electrode 132 covering the gate dielectric layer 131. The sidewall surfaces on both sides of the metal gate structure have sidewalls 140; the semiconductor substrate 100 and the fin portion 120 The surface has a first interlayer dielectric layer 150 covering sidewalls of the spacer 140 , and the top surface of the first interlayer dielectric laye...
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