Hierarchical structure construction method for hybrid integrated circuit reliability index evaluation

A hybrid integrated circuit and hierarchical structure technology, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as complex manufacturing process

Inactive Publication Date: 2017-04-19
BEIHANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The module is actually a highly integrated complex electronic system, which contains a large number of electronic components such as integrated circui

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  • Hierarchical structure construction method for hybrid integrated circuit reliability index evaluation
  • Hierarchical structure construction method for hybrid integrated circuit reliability index evaluation
  • Hierarchical structure construction method for hybrid integrated circuit reliability index evaluation

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Embodiment Construction

[0091] The DC-DC power module selected by the present invention is a highly reliable HVSA28S5 DC-DC converter, which adopts a push-pull structure and can work at 28V input voltage, with a maximum power of 45W. The circuit shell is a metal fully sealed structure , without a fixed end, using a single-layer thick-film substrate, without using chip assembly technology and multi-layer wiring technology, due to insufficient space, the circuit adopts a component stack welding process, and the circuit uses the process of welding aluminum sheets on the substrate to avoid The gold-aluminum bonding point on the aluminum wire in the wire bonding is combined with a specific actual case, and a hierarchical structure construction method for the evaluation of the reliability index of the hybrid integrated circuit described in the present invention, that is, a method suitable for the hybrid integrated circuit For methods of multivariate information extraction and hierarchical structure construc...

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Abstract

A hierarchical structure construction method for hybrid integrated circuit reliability index evaluation is as follows: first, determining a target layer of a hybrid integrated circuit reliability evaluation hierarchy, second, determining a criterion layer of the hybrid integrated circuit reliability evaluation hierarchy, and third, determining a key element layer of the hybrid integrated circuit reliability evaluation hierarchical structure. Through the above steps, making evaluation to a specific type of hybrid integrated circuit is no longer unable to start or judgment to the evaluation on the whole can prevented; specific evaluation can be made from multiple angles, at multi-level and from multi-detail aspects; more complete and reasonable grasp of the evaluation can be realized; and a problem of hybrid integrated circuit reliability index evaluation can be solved. The structural modeling thought and element classification thought of the work breakdown structure of the hierarchical structure construction method for hybrid integrated circuit can conduct hierarchical construction to a certain type of DC/DC power supply module.

Description

[0001] 1. Technical field: [0002] The present invention provides a hierarchical structure construction method aimed at evaluating the reliability index of hybrid integrated circuits, which is a method for extracting multiple information of hybrid integrated circuits and constructing hierarchical structures, and relates to a hierarchical structure construction method for DC-DC power supply modules . It combines the idea of ​​structural model in Analytic Hierarchy Process (AHP) and the element classification idea of ​​Work Breakdown Structure (WBS). Decomposition and classification serve as a reference for the subsequent quantitative calculation process and belong to the field of reliability evaluation of electronic components. [0003] 2. Background technology: [0004] In recent years, with the rapid development of military technology and weaponry in various countries, not only the demand for electronic components is increasing, but also the reliability requirements are gett...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/398
Inventor 吕旭波黄姣英高成崔灿
Owner BEIHANG UNIV
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