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A kind of oled display panel and its preparation method, oled display device

A display panel and via technology, which is applied in semiconductor/solid-state device manufacturing, organic semiconductor devices, electric solid-state devices, etc., can solve problems such as easy falling off of connecting wires, and achieve the effect of improving the binding effect and sticking firmly

Active Publication Date: 2020-03-17
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the above-mentioned deficiencies existing in the prior art, and provides an OLED display panel and its preparation method, and an OLED display device, which are used to at least partially solve the problem that the connecting wires used to bind the OLED display panel and the FPC are easy to fall off.

Method used

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  • A kind of oled display panel and its preparation method, oled display device
  • A kind of oled display panel and its preparation method, oled display device
  • A kind of oled display panel and its preparation method, oled display device

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Embodiment Construction

[0049] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0050] Such as figure 1 As shown, the present invention provides an OLED display panel, and the OLED display breadboard includes: a base 1, a connecting wire 5, an insulating layer 2, a source-drain electrode layer 3, and a planarization layer (PLN) sequentially arranged on the base 1 4. The insulating layer 2 is provided with a first via hole 6 penetrating through the insulating layer 2 , the source-drain electrode layer 3 covers the first via hole 6 , and the connection line 5 is located...

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Abstract

The invention provides an OLED display panel and its preparation method, and an OLED display device. A first via hole is opened on the insulating layer, and the first via hole is covered by a source-drain electrode layer. layer, and open a second via hole on the planarization layer with a diameter larger than that of the first via hole, so that the second via hole is connected to the first via hole, and the planarization layer is connected to the source and drain at the position of the second via hole. The pole layer forms a first step, and the connection line is at least located in the first via hole and the second via hole and at least covers the first step, that is, the connection line is connected to the planarization layer through the first step structure, so that the connection line is not easy to pass through the via hole. The area is peeled off, the connection line and the planarization layer are more firmly attached, and the binding effect between the OLED display panel and the FPC and the stability of signal transmission are improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED display panel, a preparation method thereof, and an OLED display device. Background technique [0002] The OLED display panel is connected to a PCB (Printed Circuit Board, printed circuit board) and connected to the main board by being bound to an FPC (Flexible Printed Circuit, flexible printed circuit board). [0003] In the peripheral area of ​​the OLED display panel, before forming the source pattern and the drain pattern, first form a via hole through the insulating layer, so that the source and drain electrode layer covers the via hole, and then sequentially form a planarization layer, a pixel defining layer, spacer layer, and expose the source-drain electrode layer, and form a connection line in the via hole area, the connection line is electrically connected to the source-drain electrode layer, and is electrically connected to the IC on the FPC, so as to realize O...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L51/56H10K99/00
CPCH10K59/123H10K59/131H10K71/00H10K71/20Y02E10/549H10K59/122H10K77/111H10K59/1201H01L24/29H01L24/32H01L2224/29009H01L2224/29022H01L2224/32225H10K59/124H10K2102/311
Inventor 高永益董向丹
Owner BOE TECH GRP CO LTD
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