Fan-out package structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc. performance issues
Active Publication Date: 2019-09-17
NAT CENT FOR ADVANCED PACKAGING CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, because the adhesive layer is easily deformed and twisted, it greatly affects the reliability of product packaging and reduces product performance
Warpage control is very difficult in fan-out packaging using injection molding; in addition, slippage caused by shrinkage of the injection molding packaging material is also difficult to control
Method used
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[0028] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.
[0029] In this specification, reference to "one embodiment" or "the...
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The invention discloses a fan-out packaging structure, comprising: a substrate, the substrate includes a groove; a first chip embedded in the groove of the substrate, the first chip has a first surface, and a second surface opposite to the first surface, the first surface of the first chip includes device regions, chip circuits and conductive pads, wherein the material of the substrate can flow under external heat treatment conditions so that the The second surface and side surfaces of the first chip are wrapped, and the first surface of the first chip is flush with the top surface of the substrate; the second chip mounted on the first surface of the first chip by wire bonding A chip, the second chip has a first surface and a second surface opposite to the first surface, the first surface of the second chip includes a device area, a chip circuit and a conductive pad, the first surface of the second chip The two surfaces are fixed on the first surface of the first chip, and the conductive pads on the first surface of the second chip are electrically connected to the conductive pads on the first chip through wires.
Description
technical field [0001] The invention relates to the packaging field, in particular to a fan-out packaging structure and a manufacturing method thereof. Background technique [0002] In order to meet the increasingly miniaturized, intelligent, high-performance and high-reliability development of electronic products, the miniaturization and intelligence of chips have led to an increase in the number of chip package pins, and the size of package pins is also rapidly increasing. decline. In conventional flip-chip WLP schemes, the I / O connection terminals are scattered within the surface area of the chip, thereby limiting the number of I / O connections. Fan-out wafer-level packaging can solve this problem very well. At the same time, due to its advantages of miniaturization, low cost and high integration, it is rapidly becoming the choice of new chip and wafer-level packaging technology. [0003] Existing fan-out packaging usually embeds the backside of the bare chip in epoxy ...
Claims
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IPC IPC(8): H01L23/13H01L23/14H01L23/498H01L21/48H01L21/56
CPCH01L23/49816H01L21/4853H01L21/56H01L23/13H01L23/145H01L2224/73267H01L2224/92244H01L2924/15153H01L2224/04105H01L2224/12105H01L2224/16145H01L2224/19H01L2224/32145H01L2224/32225H01L2224/48091H01L2224/48145H01L2224/73209H01L2224/73227H01L2924/00014
Inventor 林挺宇陈峰
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD