Encapsulation method for display panel, display panel and display device

A display panel and packaging method technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of unfavorable narrow frame design, uneven thickness of inorganic layers, etc., and achieve the advantages of narrow frame design, The effect of size reduction

Active Publication Date: 2018-08-07
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide a packaging method for a display panel, a display panel, and a display device, to solve the problems existing in the prior art in the process of making an inorganic layer due to the use of a metal mask. Uneven thickness, which is not conducive to the problem of narrow frame design

Method used

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  • Encapsulation method for display panel, display panel and display device
  • Encapsulation method for display panel, display panel and display device
  • Encapsulation method for display panel, display panel and display device

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Embodiment Construction

[0046] Aiming at the problem existing in the prior art that the film thickness of the inorganic layer is uneven due to the use of a metal mask in the process of making the inorganic layer, which is not conducive to the design of the narrow frame, an embodiment of the present invention provides a display panel A packaging method, a display panel and a display device.

[0047] The specific implementation manners of the packaging method of the display panel, the display panel and the display device provided by the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The thickness and shape of each film layer in the drawings do not reflect the real scale, and the purpose is only to illustrate the content of the present invention.

[0048] In the first aspect, an embodiment of the present invention provides a packaging method for a display panel, such as figure 2 shown, including:

[0049] S101. Provide a display pan...

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Abstract

The invention discloses an encapsulation method for a display panel, a display panel and a display device. The encapsulation method comprises: a main display panel body is provided, wherein the main display panel body includes an external circuit arranged in a non-display area; a protection layer at least covering the part of the external circuit is formed; an encapsulation layer for encapsulatingthe main display panel body is formed and the encapsulation layer is patterned; and the protection layer is removed. According to the encapsulation method, the protection layer is formed before forming the encapsulation layer to protect the part of external circuit and then the protection layer is removed after forming the encapsulation layer, so that a metal mask plate for shielding the externalcircuit is saved; the protection layer does not affect the making of an inorganic layer, so that a phenomenon of non-uniform thickness of the inorganic layer is avoided; reservation of a region thatmay have the non-uniform thickness in frame design is avoided; and thus the frame design is reduced and the narrow-frame design is realized.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging method of a display panel, a display panel and a display device. Background technique [0002] Currently, a bendable display can be realized through a liquid crystal display panel (Liquid Crystal Display, LCD) and an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display panel. Affected by factors such as lightness, thinness, and ease of bending of flexible displays, there are many demands for new bendable terminal devices. The bending of the flexible display product may be the bending of the display element, or the bending of the control circuit area of ​​the display element. [0003] Benefiting from the characteristics of self-luminescence, OLED displays fabricated on flexible substrates are easier to achieve bendable displays with smaller bending radii. Therefore, the fabrication of OLED display panels including flexible substrates has attract...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/844H10K71/00H10K59/131H10K50/8445H10K50/8426
Inventor 王涛孙韬张嵩
Owner BOE TECH GRP CO LTD
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