Microphone and manufacturing method thereof

A production method and technology of microphones, which are applied in the direction of loudspeakers, electrostatic transducer microphones, sensors, etc., can solve problems such as poor performance

Active Publication Date: 2018-09-14
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Generally speaking, the package of the microphone has two modes according to the way of air intake. The bottom type (bottom type) has a larger back cavity (Back volume) than the top type (top type), which also means that the bottom type microphone has a larger volume. High SNR (signal-to-noise ratio), but poor microphone air pressure test (APT) performance in bottom mode

Method used

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  • Microphone and manufacturing method thereof
  • Microphone and manufacturing method thereof
  • Microphone and manufacturing method thereof

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Embodiment Construction

[0065] The microphone of the present invention and its manufacturing method will be described in more detail below in conjunction with schematic diagrams, wherein a preferred embodiment of the present invention is represented, it should be understood that those skilled in the art can modify the present invention described here, and still realize the advantages of the present invention Effect. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0066] In the following paragraphs the invention is described more specifically by way of example with reference to the accompanying drawings. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the ...

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Abstract

The invention discloses a microphone and a manufacturing method thereof. The manufacturing method of the microphone provided by the invention comprises the following steps: providing a front-end structure; forming a first backboard layer on the front-end structure; forming a first interval layer on the first backboard layer, wherein the first interval layer is provided with a first sacrifice part;forming a vibration film layer on the first interval layer; forming a second interval layer on the vibration film layer, wherein the second interval has a second sacrifice part, and the second sacrifice part is corresponding to the first sacrifice part; forming a second backboard layer on the second interval layer; and removing the second sacrifice part and the first sacrifice part, and forming abase. Since the acquired microphone is the dual-backboard structure, an amplification signal is increased, the APT performance is improved, and the microphone can reply various encapsulation modes; and the dual-backboard structure can eliminate the undercutting of the interval layer and the backboard, and the electromechanical corrosion influence is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a microphone and a manufacturing method thereof. Background technique [0002] A microphone is a sensing device that can convert sound energy into electrical energy. The principle of a capacitive microelectromechanical system (Condenser MEMS) microphone is to cause the vibration of the vibration mode through sound pressure, and then change the capacitance to cause a change in voltage. Today, with the development of technology and the continuous growth of demand, people's demand for Condenser MEMS microphones is also increasing, especially the demand for microphones with high signal-to-noise ratio is growing rapidly. [0003] Generally speaking, the package of the microphone has two modes according to the way of air intake. The bottom type (bottom type) has a larger back cavity (Back volume) than the top type (top type), which also means that the microphone of the bottom ty...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00H04R2201/003
Inventor 王强
Owner SEMICON MFG INT (SHANGHAI) CORP
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