A snubber circuit for a half-full-bridge sub-module of a modular multilevel converter

A modular multi-level, buffer circuit technology, applied in the direction of converting AC power input to DC power output, electrical components, output power conversion devices, etc. System cost, effect of suppressing shutdown voltage

Active Publication Date: 2020-02-14
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0008] In view of the defects of the prior art, the purpose of the present invention is to solve the technical problem of complex design and high cost caused by the need for a large number of IGBTs in the prior art half-full bridge sub-module

Method used

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  • A snubber circuit for a half-full-bridge sub-module of a modular multilevel converter
  • A snubber circuit for a half-full-bridge sub-module of a modular multilevel converter
  • A snubber circuit for a half-full-bridge sub-module of a modular multilevel converter

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Embodiment Construction

[0047] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0048] The present invention describes the simplified buffer circuit design scheme by taking the MMC half-full bridge sub-module of the modularized multilevel converter as an example. figure 2 It is a schematic diagram of the topology structure of the modular multilevel converter MMC provided by the embodiment of the present invention. Such as figure 2 As shown, it includes three phases A, B, and C, and each phase includes two upper and lower bridge arms. Each bridge arm is composed of N half-full bridge sub-modules cascaded and connected in series with a bridge arm inductor.

[0049] image 3 I...

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Abstract

The invention discloses a buffer circuit of a half-full-bridge sub-module of a modular multilevel converter. The half-full-bridge sub-module includes a left half-bridge module, a right half-bridge module and a connecting circuit; it also includes three sets of RCD buffer circuits, Each set of RCD snubber circuits includes: a resistor and a diode connected in parallel and connected in series with a capacitor, and the cathode of the diode is connected to the anode of the capacitor. The present invention proposes a buffer structure of three sets of RCD snubber circuits. The first set of RCD snubber circuits suppresses the IGBT turn-off voltage spikes of the left half-bridge module, and the second set of RCD snubber circuits suppresses the IGBT turn-off voltage spikes of the right half-bridge module. The IGBT turn-off voltage peak of the connected circuit is suppressed by the third group of RCD snubber circuits, which simplifies the snubber circuit of the half-full bridge sub-module, and can better suppress the IGBT turn-off voltage while reducing the cost of the snubber circuit; the invention proposes RCD The parameter design of the snubber circuit can reduce the system cost and ensure that the IGBT turn-off overvoltage does not overshoot.

Description

technical field [0001] The invention belongs to the research field of IGBT snubber circuits, and more specifically relates to a snubber circuit of a half-full-bridge sub-module of a modularized multilevel converter. Background technique [0002] Modular Multilevel Converter (MMC) has the advantages of modular structure, easy packaging and expansion, small switching device stress and low output voltage harmonics, and has been applied in practical projects, such as the Transbay project in the United States, China's Zhoushan five-terminal flexible DC transmission project. [0003] According to different sub-module topological structures, modular multilevel converters are generally divided into three types: half-bridge type, full-bridge type and clamped double type. The Semi-Full Bridge Sub-module (SFB-SM) is a clamping dual-type sub-module, which consists of 7 IGBT anti-parallel diodes, with +2Uc, +Uc, 0 and -Uc four A level output capability. Compared with the full-bridge s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/34H02M7/483
CPCH02M1/34H02M7/483H02M1/348H02M7/4835
Inventor 林磊徐晨胡凯周雪妮
Owner HUAZHONG UNIV OF SCI & TECH
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