A low profile miniaturize phased array antenna

A phased array antenna, low profile technology, applied in the directions of antennas, antenna arrays, electrical components, etc., can solve the problems of high manufacturing cost of phased array antennas, difficult to achieve miniaturization and low profile, complex interconnection process, etc. The effect of web phase consistency, reduced longitudinal size, space saving

Pending Publication Date: 2019-01-15
CHENGDU RDW TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] To sum up, the current active phased array antenna schemes are designed separately for the radiation unit and the TR component, and a large number of connectors are used for interconnection, which makes production extremely difficult, and the interconnection process is complicated, making it difficult to achieve miniaturization and low profile , and objectively make the manufacturing cost of the phased array antenna relatively high, so the phased array antenna with high integration, miniaturization and low cost is still the development trend of the current phased array antenna

Method used

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  • A low profile miniaturize phased array antenna
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  • A low profile miniaturize phased array antenna

Examples

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Effect test

Embodiment 1

[0031] refer to figure 1, a low-profile miniaturized phased array antenna includes two large modules, an antenna TR module, a power supply and a difference module, and the antenna TR module includes an antenna radiation unit, a CMOS multi-function chip, a passive power division network, and a wave control PCB board , Antenna TR component module cavity, antenna TR module longitudinal dimension is 14mm, power supply and difference module includes soft substrate of summator module, power printed circuit board and power supply and difference module cavity, module longitudinal dimension is 12mm. The high-frequency signal interconnection between modules uses the radio frequency vertical interconnection method, the low-frequency interconnection between modules is realized by low-frequency pins, and the high-frequency signal interconnection between boards uses interlayer vertical interconnection and radio frequency insulators. Screws are used to fix the cavities, and the longitudinal ...

Embodiment 2

[0033] refer to figure 1 , The present invention is characterized in that the two modules are integrated into a phased array antenna with a longitudinal dimension of only 26 mm by adopting a vertical high-density integration method and using radio frequency vertical interconnection technology. Including antenna TR module, power supply and difference module, antenna TR module includes antenna radiation unit, CMOS multi-function chip, passive power division network, wave control PCB board and an installation cavity, power supply and difference module includes power printed circuit Board, summator network and an installation cavity, the power printed circuit board is connected to the outside through a low-frequency connector, and the soft substrate of the summator module is connected to the outside through SMP, and all modules are vertically stacked and installed.

[0034] The antenna radiation unit in the antenna TR module adopts an array composed of microstrip patch antennas. T...

Embodiment 3

[0041] A low-profile miniaturized phased array antenna includes an antenna TR module and a power supply and a difference module. The antenna TR module includes an antenna TR module cavity 5, an antenna TR component printed circuit board 6 and a wave control PCB board 3, and the antenna TR component printed circuit board 6 and the wave control PCB board 3 are respectively Installed on both sides of the antenna TR module cavity 5, the power supply and difference module includes a power supply and difference module cavity 16, a power printed circuit board 4 and a soft substrate 9 of the sum difference module, and the power printed circuit The board 4 and the summator module soft substrate 9 are installed on both sides of the power supply and the difference module cavity 16 respectively.

[0042] The printed circuit board 6 of the antenna TR component is a high-frequency microwave multilayer board, and the antenna radiation unit 17, the CMOS multifunctional chip 18 and the passive...

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Abstract

The invention relates to the field of radar communication, in particular, a low profile miniaturized phased array antenna is realized in a three-dimensional integrated manner, comprises an antenna TRmodule and a power supply and differentiator module, the high frequency signal interconnection between the antenna tr module and the power supply and differentiator module is implemented using radio frequency vertical interconnection, A low frequency interconnect is implement using a low frequency pin, the antenna TR module comprises an antenna TR module cavity, Antenna TR module printed circuit board and wave control PCB board, A printed circuit board of the antenna TR module and a waveform control PCB are respectively arranged on both sides of the cavity of the antenna TR module, As that microwave multilayer PCB board is use, the vertical interconnection between layers is realize, thereby realizing ultra-small longitudinal dimension integration, vertical interconnection blind insertion mode is adopted between the soft substrate part of the summer module and the prin circuit board of the antenna TR module, and the radio frequency traces are reduced by using the vertical interconnection between layers inside the microwave multilayer board.

Description

technical field [0001] The invention relates to the field of radar communication, in particular to a low-profile miniaturized phased array antenna realized by means of three-dimensional integration. Background technique [0002] Phased array antennas are divided into active phased array antennas and passive phased array antennas. Passive phased array antennas share a central amplifier for the transmission channels of all antenna units, and a low-noise amplifier for the reception channels, causing the signal to reach the antenna during transmission. The power of the radiating unit cannot be very large, and the loss of the received signal is large when receiving; each radiating unit of the active phased array antenna has a set of transmitting amplifiers and receiving low-noise amplifiers, so it has a large radiation power when transmitting , relatively high gain when receiving. [0003] Active phased array antennas are the trend of modern radars. In addition to meeting the re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q21/00H01Q23/00
CPCH01Q21/00H01Q23/00
Inventor 刘雪颖马明凯余正冬章圣长
Owner CHENGDU RDW TECH CO LTD
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