72results about How to "Reduce trace length" patented technology

The invention provides a signal receiving and transmitting device and terminal equipment. The signal receiving and transmitting device comprises a first communication module and a second communicationmodule, a first switch is respectively connected with the first end of the first communication module and the first end of the second communication module; a second switch is connected with the second end of the first communication module; a first antenna structure is connected with the second switch; a third switch is connected with the second end of the second communication module; a second antenna structure is connected with the third switch; Wherein the first communication module corresponds to a first transmitting link and two receiving links, and the second communication module corresponds to a second transmitting link and two receiving links; At least one of the first transmitting link and the second transmitting link is conducted during signal transmitting, and two receiving linkscorresponding to the first communication module and the second communication module are conducted during signal receiving. According to the invention, the insertion loss of a receiving link can be reduced, the performance of a transmitting link is improved, the routing length is reduced, and the compatibility of 1T4R and 2T4R modes is realized.

The present invention provides a stacked chip scale package structure, wherein a lower chip and an upper chip are stacked on a substrate. Two rows of bonding pads are disposed on each of the upper and lower chips. The bonding pads on the upper and lower chips are parallel arranged. At least a dummy die is disposed below the suspended portion of the upper chip and at the side of the lower chip as a support during wire bonding. A gap is reserved between the dummy die and the lower chip. The present invention utilizes the design of dummy die to resolve the problem of die crack caused by wire bonding of suspended chip. Therefore, the present invention can flexibly adjust the size and installation direction of the upper chip to meet the requirement of substrate layout, and can also shorten the trace length on the substrate to enhance the electric performance thereof.</PTEXT>

The invention relates to the field of radar communication, in particular, a low profile miniaturized phased array antenna is realized in a three-dimensional integrated manner, comprises an antenna TRmodule and a power supply and differentiator module, the high frequency signal interconnection between the antenna tr module and the power supply and differentiator module is implemented using radio frequency vertical interconnection, A low frequency interconnect is implement using a low frequency pin, the antenna TR module comprises an antenna TR module cavity, Antenna TR module printed circuit board and wave control PCB board, A printed circuit board of the antenna TR module and a waveform control PCB are respectively arranged on both sides of the cavity of the antenna TR module, As that microwave multilayer PCB board is use, the vertical interconnection between layers is realize, thereby realizing ultra-small longitudinal dimension integration, vertical interconnection blind insertion mode is adopted between the soft substrate part of the summer module and the prin circuit board of the antenna TR module, and the radio frequency traces are reduced by using the vertical interconnection between layers inside the microwave multilayer board.

The invention relates to a single-layer multi-point capacitive touch screen comprising a touch panel, and a visible area is arranged on the touch panel, wherein a plurality of independent electrode units arranged in a multi-row multi-column array are arranged in the visible area, and wires are led from the electrode units respectively. The visible area comprises a first end portion visible area, a second end portion visible area and a middle visible area located between the first end portion visible area and the second end portion visible area, wherein the wires of the electrode units in the first end portion visible area are led out of the top of the first end portion visible area, the wires of the electrode units in the middle visible area are led out of one side of the visible area, and the wires of the electrode units in the second end portion visible area are led out of the top of the second end portion visible area. The middle wires of the electrode units of the middle visible area are led out of one side of the visible area, so the lengths of the wires of the middle visible area is short, the total length of the wires of the whole visible area is made to decrease, and thus the resistance value of a whole sensing channel is reduced.

The invention discloses a printed broadband terminal antenna, and mainly solves a problem that an antenna in the prior art cannot satisfy people's requirements of broadband and miniaturization of the antenna at the same time. The printed broadband terminal antenna comprises a printed circuit board, a printed board metal platform disposed on a surface of the printed circuit board, and also comprises a first bending metal strips group and a second bending metal strips group disposed on the other surface of the printed circuit board, a microstrip feeder connected with an end of the first bending metal strips group, and an earthing device connected with the second bending metal strips group. The second bending metal strips group has a semi-enclosed cyclic structure and surrounds the first bending metal strips group. With the above scheme, the printed broadband terminal antenna achieves an objective of realizing antenna miniaturization while the bandwidth is guaranteed, and has very high utility value popularization value.

The embodiment of the invention discloses a chip-stacking encapsulation structure and electronic equipment. The chip-stacking encapsulation structure comprises a first chip and a second chip, wherein the second chip and the first chip are arranged in a stacking manner, the second chip comprises an encapsulation layer and a first wiring layer, the encapsulation layer comprises at least two crystalline grains and a fixing portion used for fixing the at least two crystalline grains, a plurality of through holes are opened in the fixing portion, a part of the through holes of the plurality of through holes is formed in the peripheries of the at least two crystalline grains, and the other part of the through holes of the plurality of through holes is formed between the at least two crystalline grains; the first wiring layer is electrically connected with the at least two crystalline grains; the encapsulation layer is located between the first wiring layer and the first chip, conductive materials are arranged in the plurality of through holes, and the first wiring layer and the first chip are electrically connected by the conductive materials, thus the first chip can be electrically connected with at least one of the at least two crystalline grains.

The invention relates to a monolayer multipoint capacitive touch screen which comprises a touch panel with a visible area. A plurality of independent multi-line multi-column electrode units are arranged in the visible area and the visible area comprises a first end visible area, a second end visible area and a middle visible area. The electrode units in the first end visible area are connected to a first end non-visible area through independent first lines; the electrode units in the middle visible area are connected to a side edge non-visible area through independent middle lines; and the electrode units in the second end visible area are connected to a second end non-visible area through independent second lines. In the side edge non-visible area, the middle lines are connected to the first end non-visible area through a second conducting wire; and in the second end non-visible area, the second lines are connected with and penetrate through the side edge non-visible area through a third conducting wire and then are connected to the first end non-visible area. Line lengths of the middle visible area are short, a resistance value of a whole sensing channel is reduced, and medium and large dimensions can be supported.

A method and system are disclosed to reduce trace length and capacitance in a large memory footprint. When more dual in-line memory module (DIMM) connectors are used per memory channel, the overall bus bandwidth may be affected by trace length and trace capacitance. In order to reduce the overall trace length and trace capacitance, the system and method use a palm tree topology placement, i.e., back-to-back DIMM placement, to place surface mount technology (SMT) DIMM connectors (instead of through-hole connectors) back-to-back in a mirror fashion on each side of a printed circuit board (PCB). The system and method may improve signal propagation time when compared to the commonly used traditional topology placements in which all DIMM connectors are placed on one side of the PCB.

The invention discloses an eight-processor system and a server and relates to the field of computer communication. The eight-processor system comprises an interconnector arranged on the same with a backboard of a server system, wiring length between a CPU (central processing unit) and the interconnector and between the CPU and the server system in the eight-processor system is shortened. The eight-processor system has good system maintainability. The eight-processor system further comprises an outer frame, the body of the outer frame is of hollow structure, one side of the outer frame, distant from the backboard of the server system, is provided with an opening, the interconnector is mounted on the lateral side, facing the backboard of the server system, of the outer frame, the lateral side, facing the backboard of the server system, of the outer frame is provided with a first opening window and a second opening window. A first processor mainboard and a second processor mainboard are respectively fixedly connected with the interconnector via the first opening window and the second opening window and are respectively fixedly connected with the backboard of the server system.

The invention provides an image collection system comprising an image sensor used for converting an optical signal with image information into an electric signal; a flexible circuit board connected with the image sensor and used for outputting the electric signal obtained by the image sensor; a reading chip connected with the flexible circuit board and used for reading the electric signal, and the reading chip is packaged in a ball grid array mode and is laminated on the surface of the flexible circuit board. The reading chip packaged in the ball grid array mode has the advantages of small package area, large pin number and high reliability, the distance between the pins of the reading chip packaged in the ball grid array mode is relatively large, so that the processing success rate is high, the interference between receiving channels of the reading chip is relatively small, the noise of the reading signals of the reading chip can be reduced, and the signal to noise ratio can be improved.

The invention provides a multiport register file circuit comprising a write address decoder circuit, a read address decoder circuit, a first memory array, a second memory array, a first input data buffer circuit, a third input data buffer circuit, a first sense amplifier array, a third sense amplifier array, a second input data buffer circuit, a fourth input data buffer circuit, a second sense amplifier array and a fourth sense amplifier array, wherein the first memory array and the second memory array are respectively connected with the write address decoder circuit and the read address decoder circuit, the first input data buffer circuit and the third input data buffer circuit are mutually reversed and are connected with the first memory array, the first sense amplifier array and the third sense amplifier array are connected with the first memory array, the second input data buffer circuit and the fourth input data buffer circuit are mutually reversed and are connected with the second memory array, and the second sense amplifier array and the fourth sense amplifier array are connected with the second memory array. The multiport register file circuit can supply 17 read data ports and 9 write data ports at the same time, and each port has 32-bit data signals, thereby the multiport register file circuit is capable of being applied into a digital signal processor of a very long instruction word structure.

The invention discloses a liquid crystal display device. By use of a method that a first repair line and a second repair line pass through a first edge area and a second edge area to surround a firstdisplay area and a second display area or a method that a repair unit is placed in the first edge area and/or the second edge area, the passing length of the repair lines is reduced, parasitic capacitance and parasitic resistance on the repair lines are reduced, and the purposes of increasing the success rate of broken line repair, saving the cost, improving capacity and reducing the scrappage ofthe liquid crystal display device are achieved.

The invention discloses an intelligent airing and drying device, which comprises a box body and control cabinets, wherein the control cabinets are arranged on the bottom or the side face of the box body; a power source module and a control module are arranged in the control cabinets; airing and drying frames are arranged inside the box body; an exhaust device is arranged on the top of the box body; a plurality of rotating shafts are closely arranged on the airing and drying frames side by side; each rotating shaft can be independently rotated; the airing and drying frames are provided with heating devices; the box body is made of a transparent material; to-be-dried materials are placed on the airing and drying frames; when sunlight irradiates the outside of the box body, the to-be-dried materials can be directly aired by utilizing the temperature of sunlight; and after the materials on the airing and drying frames are aired and dried for a period of time, the rotating shafts are controlled to rotate, and the materials are sequentially aired and dried after being overturned. The rotating shafts are arranged on the airing and drying frames, the materials are overturned by adopting the rotating shafts, and the materials can be relatively uniformly and adequately aired, so that the airing speed and efficiency are effectively improved.

The invention discloses a fuel cell current density partition test system and method, and belongs to the technical field of fuel cell in-situ detection. The system comprises a gas supply module, an electronic load, a signal amplification module, a data acquisition module, a data processing module and a fuel cell stack. The gas supply module provides an oxidizing agent and fuel for the fuel cell stack, the electronic load is loaded on the fuel cell stack, the signal amplification module amplifies a signal transmitted by the fuel cell stack, the data acquisition module acquires an output signalof the signal amplification module, and the data processing module processes the signal acquired by the data acquisition module. According to the invention, the sampling resistor is placed at the backof the partitioned gold-plated copper foil, so that the consistency of impedance of each partition is ensured. The impedance of each subarea is consistent, so that the sampling result can truly reflect the actual current density distribution characteristic in the galvanic pile. The problems that the precision of the sampling resistor is difficult to control and the device cost is high are solved,and the current density distribution of a large number of matrix partitions can be measured.

The invention discloses a connecting device and connecting structure for high-voltage battery modules in an electric automobile. The connecting device comprises an upper cover plate of the device, a low-voltage connecting module, a high-voltage copper bar connecting module and a lower cover plate of the device, wherein the low-voltage connection module comprises a low-voltage wire harness assembly and a flexible circuit board assembly; and the high-voltage copper bar connecting module comprises a high-voltage copper bar, a copper bar temperature sensor for detecting the temperature of the high-voltage copper bar is arranged on the high-voltage copper bar, and the copper bar temperature sensor is electrically connected with the flexible circuit board assembly. According to the invention, through concentrated wiring, the wiring lengths of the high-voltage copper bar and low-voltage wire harnesses are reduced, the wiring disorder of the high-voltage copper bar and the low-voltage wire harnesses is avoided, the space utilization rate of an internal circuit of the power battery is increased, a scheme is provided for production automation, the external packaging cost of the high-voltage busbar and the low-voltage wire harnesses is reduced, a connection path is optimized, and a design scheme is provided for modularization and platformization.

The invention discloses a method for reducing parasitic capacitance of a feedback resistor and improving bandwidth of a trans-impedance amplifier, which shields an output field of the feedback resistor by reasonably placing a grounding shielding wire under the feedback resistor and prevents the output field from reaching a summation node end of the feedback resistor, so that the output field is effectively shunted to the ground, and the parasitic capacitance of the feedback resistor is reduced, so that the bandwidth of the TIA is improved. On the basis of the prior art, the parasitic capacitance of the feedback resistor can be further reduced, and the bandwidth of the trans-impedance amplifier is further improved.

The invention relates to the technical field of display and particularly relates to a display panel and a production method thereof. The production method of the display panel comprises the followingsteps: successively forming lead wires and a light-emitting function layer on a substrate, wherein the light-emitting function layer covers the lead wires; forming conducting channels in the light-emitting function layer, wherein the conducting channels extend from one side away from the substrate of the light-emitting function layer to the lead wires; forming a cathode layer on the light-emittingfunction layer, wherein the cathode layer is connected with the conducting channels. According to the scheme, conducting particles are poured into the light-emitting function layer to form the conducting channels, so that the cathode is connected with the lead wires; the wiring length between the cathode and the lead wires is reduced; the touch control blind area on the display panel caused by the oversized wiring area is avoided.

A fingerprint sensor comprises a substrate, pixel units, signal lines, multiple exposed substrate binding pads, a printed circuit board, multiple exposed circuit board binding pads and binding lines, wherein the pixel units are arranged on the substrate in an array mode for acquiring fingerprint signals; the signal lines are located on the substrate for transmitting the fingerprint signals acquired by the pixel units; the multiple exposed substrate binding pads are located on the substrate and are correspondingly connected with the signal lines; the printed circuit board is located below the substrate for being connected with other systems; the multiple exposed circuit board binding pads are located on the printed circuit board; and the binding lines are connected with the substrate binding pads and the circuit board binding pads for realizing electrical conduction between the substrate binding pads and the circuit board binding pads. Thus, the use of a flexible circuit board is saved; the signal line wiring length is shortened; noise of the device can be effectively reduced; the stability and the yield rate of the device are improved; the area and the volume occupied by the fingerprint sensor can be narrowed; and the device manufacturing cost is reduced.

The invention discloses an electromagnetic damping buffer foldable attachment leg for small celestial body detection. In order to adapt to small celestial body detection task requirements, equivalentdamping is generated by force control of a motor to realize landing buffering of landing legs; meanwhile, the design of the foldable landing legs is adopted, and a driving motor in folding motion anda motor for buffering and energy absorption are reused, so that the landing legs have a buffering function while being folded, and the problems that the buffering performance of a traditional buffering landing leg mechanism cannot meet the requirement, and the buffering landing design means is single are solved.

A TDICCD series control system for a spacecraft based on microsystem packaging comprises a ceramic pin array tube shell, a ceramic substrate, a tube core chip, a multi-layer ceramic dielectric capacitor, a metalized cover plate and a thick film resistor, a plurality of passive and active devices with different functions are packaged in one shell to become a single standard packaging product with multiple functions, and the single standard packaging product has multiple functions. According to the invention, the device has the functions of a system or a subsystem, employs an unpackaged die chip to replace a packaged device, carries out the integration through a ceramic substrate with a smaller size, and can carry out the series control of a multispectral band.

The invention provides an antenna module and electronic equipment. The antenna module comprises a first antenna, a second antenna, a third antenna, a fourth antenna, a first transceiving module, a second transceiving module, a first receiving module, a second receiving module, a third switch, a fourth switch, a fifth switch, a sixth switch, a first switch and a second switch, the third switch is connected with the first antenna, the second antenna, the fifth switch and the second receiving module; the fourth switch is connected with the third antenna, the fourth antenna, the sixth switch and the second transceiving module; the fifth switch is connected with the sixth switch and the first transceiving module, and the sixth switch is connected with the first receiving module; the first switch is connected with the first antenna and the first transceiving module, and the second switch is connected with the fourth antenna and the first receiving module. Therefore, the number of devices onthe module can be reduced, the wiring length of the module is shortened, the module insertion loss is reduced, and the performance of the electronic equipment is improved.

The invention discloses a vacuum food processor convenient to clean. The vacuum food processor comprises a vacuumizing device, a processor base, a stirring cup and a smashing cutter; and the stirring cup comprises a cup body, a cup base and a cup cover, the cup cover is provided with a communicating hole communicating with the interior of the cup body, a handle and a handle cover are arranged on one side of the cup body, the vacuumizing device comprises an air pump, an air suction pipe, an air exhaust pipe and an air pump circuit board, the cup base is provided with a sealing cavity, the air pump is arranged in the sealing cavity, a first interlayer is arranged between the handle cover and the side wall of the cup body, the first interlayer downwards extends to the sealing cavity, a first transferring head is arranged on the handle cover, the cup cover is provided with a second transferring head communicating with the communicating hole, one end of the air suction pipe is connected with the air pump, the other end of the air suction pipe extends out of the cup base and then extends upwards along the first interlayer to be connected to the first transferring head, and the second transferring head is in inserted-connection fit with the first transferring head. According to the vacuum food processor, a user can conveniently clean the overall stirring cup.