Decoupling packaging structure of surface acoustic wave filter bank

Abstract

The invention provides a decoupling packaging structure of a surface acoustic wave filter bank. The packaging structure comprises a metal packaging base, a metal packaging cap, a grounding metal sheet and a metal wall; the metal packaging base and the metal packaging cap are in sealed bonding connection; a tuning substrate of the surface acoustic wave filter bank is arranged above the metal packaging base; the surface acoustic wave filter bank is arranged above the tuning substrate; the surface acoustic wave filter bank comprises a plurality of surface acoustic wave filter chips; a grounding metal sheet is arranged on the upper surface of the tuning substrate; the grounding metal sheet is used for separating the area where each surface acoustic wave filter chip is located; the metal wall is arranged above the grounding metal sheet, one end of the metal wall is connected with the grounding metal sheet, and the other end of the metal wall is connected with the metal packaging cap; an embedded metal wire is arranged in the tuning substrate; and the embedded metal wire is used for electrically connecting the surface acoustic wave filter chips with a tuning circuit setting area of the surface acoustic wave filter.

Description

Technical field [0001] The present invention proposes a sound surface filter set to decouple a structure, which belongs to the technical field of thin film filter. Background technique [0002] The sound surface Wave filter is in order to achieve a good decoupling effect during the package, often requires the setting of the package structure through each acoustic surface filter, but this method is set to the package structure due to the setup circuitry. External, resulting in the case where the circuit is complex, the circuit anti-interference ability is poor, and the prior art is in the prior art to set the tuning circuit in the package structure inside, although the connection complexity of the circuit line is simplified, but due to the tuning circuit In one space with the sound surface filter, the magnetic field generated by the operation of the tuning circuit causes a certain interference, making the performance of the sound surface filter reduce the performance. Inventive c...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a decoupling packaging structure of a surface acoustic filter bank, which is used to solve the problem that the circuit structure between the surface acoustic filter chip and the tuning circuit is complicated due to the independent packaging structure of the decoupling packaging structure of the surface acoustic filter bank, and then It is easy to generate circuit interference and cause the performance degradation of the SAW filter. The technical solutions adopted are as follows:

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