Image collection system

An image acquisition system and image information technology, applied in the field of sensors, can solve the problems of low signal-to-noise ratio and large signal-noise, and achieve the effects of improving signal-to-noise ratio, signal-to-noise ratio, yield and reliability

Inactive Publication Date: 2017-01-11
上海瑞艾立微电子科技有限公司
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Problems solved by technology

[0007] However, in the existing image acquisition system, the way of connecting the readout chip and the image sensor has the problems of relatively large signal noise and low signal-to-noise ratio.

Method used

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Embodiment Construction

[0034] It can be seen from the background art that the way of connecting the readout chip and the photosensitive array in the existing image acquisition system has the problems of relatively large signal noise and low signal-to-noise ratio. Now combined with the structure of the existing image acquisition system to analyze the reasons for its large noise problem:

[0035] refer to figure 2 , shows a schematic structural diagram of an image acquisition system in the prior art.

[0036] The readout chip 24 is directly welded on the printed circuit board 29 , and the image sensor 20 and the printed circuit board 29 are connected by a flexible circuit board (Flexible Printed Circuit, FPC) 26 .

[0037] The disadvantage of this structure is that the distance between the photosensitive array 21 of the image sensor 20 and the readout chip 24 on the printed circuit board 29 is relatively long, and the wiring connecting the photosensitive array 21 and the readout chip 24 needs to spa...

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Abstract

The invention provides an image collection system comprising an image sensor used for converting an optical signal with image information into an electric signal; a flexible circuit board connected with the image sensor and used for outputting the electric signal obtained by the image sensor; a reading chip connected with the flexible circuit board and used for reading the electric signal, and the reading chip is packaged in a ball grid array mode and is laminated on the surface of the flexible circuit board. The reading chip packaged in the ball grid array mode has the advantages of small package area, large pin number and high reliability, the distance between the pins of the reading chip packaged in the ball grid array mode is relatively large, so that the processing success rate is high, the interference between receiving channels of the reading chip is relatively small, the noise of the reading signals of the reading chip can be reduced, and the signal to noise ratio can be improved.

Description

technical field [0001] The invention relates to the field of sensors, in particular to an image acquisition system. Background technique [0002] Amorphous silicon image sensors are widely used in large-scale X-ray detectors, such as those used in chest X-rays and security inspections, due to their low cost, large area, and good X-ray resistance. [0003] refer to figure 1 , shows a schematic diagram of an application circuit of an image acquisition system. [0004] The image acquisition system includes: an image sensor 10, on which a photosensitive array 11 is formed for obtaining electrical signals with image information. The amorphous silicon image acquisition system further includes a driving notification circuit 12 and a driving control circuit 13 for driving the photosensitive array 11 to output the electrical signal; and a readout circuit 14 for reading the electrical signal. [0005] When light is irradiated on the photosensitive array 11 of the image sensor 10 , ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/335H04N5/32H01L27/146
Inventor 朱虹林崴平
Owner 上海瑞艾立微电子科技有限公司
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