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Microsystem packaging-based TDICCD series control system for spacecraft

A control system and micro-system technology, applied in the field of aerospace optical remote sensor microelectronics, can solve problems such as the inability to meet circuit scale and market demand, and achieve the effects of improving module integration, reducing wiring length, and high packaging density

Pending Publication Date: 2022-04-12
BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] The technical problem solved by the present invention is: Aiming at the problem that the traditional PCB board circuit structure can no longer meet the current circuit scale and market demand in the current prior art, a TDICCD series control system for spacecraft based on microsystem packaging is proposed

Method used

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  • Microsystem packaging-based TDICCD series control system for spacecraft
  • Microsystem packaging-based TDICCD series control system for spacecraft

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Embodiment Construction

[0024] A TDICCD series control system for spacecraft based on microsystem packaging, making full use of the vertical space of the ceramic substrate, adopting high-density interconnection technology and blind buried hole wiring technology, rationally laying out different functional devices, and improving the performance of the module circuit , and at the same time realize the TDICCD delay integration function through the die chip, the specific structure is:

[0025] Including ceramic pin array shell, ceramic substrate, die chip, multilayer ceramic dielectric capacitor, metallized cover plate, thick film resistor, thick film resistor is integrated inside the ceramic substrate by slurry coating, and the ceramic substrate is bonded to the ceramic In the inner cavity of the pin array shell, the edge of the ceramic substrate is connected to the bonding fingers of the ceramic pin array shell by wire bonding, and the die chip and the multilayer ceramic dielectric capacitor are bonded t...

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Abstract

A TDICCD series control system for a spacecraft based on microsystem packaging comprises a ceramic pin array tube shell, a ceramic substrate, a tube core chip, a multi-layer ceramic dielectric capacitor, a metalized cover plate and a thick film resistor, a plurality of passive and active devices with different functions are packaged in one shell to become a single standard packaging product with multiple functions, and the single standard packaging product has multiple functions. According to the invention, the device has the functions of a system or a subsystem, employs an unpackaged die chip to replace a packaged device, carries out the integration through a ceramic substrate with a smaller size, and can carry out the series control of a multispectral band.

Description

technical field [0001] The invention relates to a TDICCD series control system for spacecraft based on microsystem packaging, and belongs to the field of microelectronic technology for aerospace optical remote sensors. Background technique [0002] In the field of space remote sensing, time-delay integration charge-coupled device TDICCD has been widely used because of its outstanding imaging ability and high sensitivity. With the continuous development of remote sensing technology, the functional requirements of the TDICCD data processing circuit are becoming more and more complex, and the requirements for volume, weight and cost are getting smaller and smaller. On the one hand, limited by the volume and weight of the circuit, the use of traditional PCB boards has gradually failed to meet the current circuit scale requirements. On the other hand, the cost of circuits composed of a large number of chips has gradually failed to meet market demand. Therefore, on the premise of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/053H01L23/06H01L23/15H01L23/49H01L23/488H01L25/16
CPCH01L2224/48091H01L2924/00014
Inventor 李苏原韩志学贺强民董龙梁楠曹伟王旭王衍何志宽李映宝薄姝王洋苏浩航富帅
Owner BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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