Intelligent power module and manufacturing method thereof

Abstract

The invention discloses an intelligent power module and a manufacturing method thereof. The intelligent power module comprises a circuit, power elements, non-power elements and a paper heat radiator serving as a carrier, and the power elements and the non-power elements are arranged at preset positions of the circuit. One surface of the heat radiator serves as a front surface covered with an insulating layer, and the circuit is arranged on the insulating layer; the other surface of the aluminum substrate serves as a back surface provided with creases for heat radiation. The power elements comprise power devices which comprise an IGBT (insulated gate bipolar transistor) tube and an FRD (fast recovery diode) tube connected with the IGBT tube, a bearing plate is arranged at the bottom of the FRD tube which is inverted and fastened to a preset position of the IGBT tube, the top of the FRD tube contacts with the IGBT tube, and the bearing plate is connected with the IGBT tube through the circuit. Reduction of cost, size and weight of the intelligent power module is realized while excellent heat radiation effects are achieved.

Description

technical field [0001] The invention relates to the technical field of intelligent power modules, in particular to a miniaturized and low-cost intelligent power module and a manufacturing method thereof. Background technique [0002] Intelligent Power Module (IPM, Intelligent Power Module) is a power drive product that combines power electronics and integrated circuit technology. The intelligent power module integrates the power switching device and the high-voltage driving circuit, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the intelligent power module receives the control signal from the MCU to drive the subsequent circuit to work, and on the other hand, it sends the system status detection signal back to the MCU. Intelligent power modules win more and more markets with their advantages of high integration and high reliability, and are especially suitable for frequency converters and various inverter power ...

AI Technical Summary

Problems solved by technology

[0005] It can be seen from Figure 1(C) that the current intelligent power module is controlled by 1 HVIC tube and 6 IGBT tubes, resulting in long wiring and easy interference between lines. Inconsistent distances make it difficult to control the signal transmission consistency of the 6 IGBT tubes

[0006] In addition, because too much circuit wiring on the substrate will inevitably increase the area of ​​the substrate, resulting in an increase in the area of ​​the current smart power module, which increases the manufacturing cost of the smart power module. In addition, due to the need to reserve the circuit wiring area, the distance between components Larger, the bonding wires that connect components through metal wires are longer, which affects the reliability of the bonding wires, and there is a risk of punching wires during the molding process

[0007] Moreover, due to the large distributed inductance and capacitance caused by the structure of the current intelligent power module, the switching loss is very high, and the actual operation of the current intelligent power module generates heat very seriously, so a thick and heavy circuit substrate 206 is needed as a heat sink to help the IGBT Tubes and FRD tubes for heat dissipation, for applications with higher power, such as driving an inverter air conditioner compressor, as shown in Figure 1(E), a larger aluminum radiator 220 needs to be connected externally to the circuit board 106, Increase the material cost, transportation cost and application cost of smart power modules, hindering the popularization of smart power modules

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