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Chip packaging and positioning clamp

A technology for positioning fixtures and chip packaging, applied in manufacturing tools, workpiece clamping devices, etc., can solve problems such as insufficient accuracy of alignment holes, and achieve the effect of precise positioning and correction

Pending Publication Date: 2019-01-22
GUANGDONG RUIGU OPTICAL NETWORK COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, LD chip positioning is one of the most critical core technologies in the packaging process. When packaging, it is necessary to ensure that the chip position is correct. The existing chip positioning device generally sets alignment holes on the chip mounting position, but the alignment holes Insufficient precision of

Method used

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  • Chip packaging and positioning clamp
  • Chip packaging and positioning clamp
  • Chip packaging and positioning clamp

Examples

Experimental program
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Embodiment Construction

[0022] The present invention is further described in conjunction with the following examples.

[0023] Such as Figure 1~4 As shown, the chip package positioning fixture includes a base 1 and a chip mounting position 11 arranged on the base 1. A height adjustment member 7 is installed below the chip mounting position 11 to adjust the height of the chip mounting position 11. The base 1 is provided with a longitudinal The slide rail 4 and the horizontal slide rail, the horizontal slide rail is divided into a left slide rail 13 and a right slide rail 14 with the chip mounting position 11 as a node, and the chip mounting position 11 is arranged at the intersecting position of the vertical slide rail 4 and the horizontal slide rail. It also includes a longitudinal jaw 3 and two oppositely arranged transverse jaws, the left jaw 9 and the right jaw 6 which are arranged axially symmetrically with the longitudinal jaw 3 for these two transverse jaws, and are used to drive the longitudi...

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PUM

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Abstract

The invention relates to the technical field of semiconductor laser devices, in particular to a chip packaging and positioning clamp. The chip packaging and positioning clamp comprises two transverseclamping jaws which are separately arranged on two opposite sides of a chip mounting position, a longitudinal clamping jaw is arranged on the other side which is adjacent to the two transverse clamping jaws, a longitudinal sliding track and a transverse sliding track on the base drive the transverse clamping jaws and the longitudinal clamping jaws to be close to or away from the chip mounting position, when the three clamping jaws are totally opened, the products are placed on the surface of the chip mounting position by a sucker, the three clamping jaws are simultaneously closed oppositely toform triangular positioning, and a chip is accurately positioned and corrected.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a chip package positioning fixture. Background technique [0002] LD (semiconductor laser) has many advantages such as high efficiency, long life, good beam quality, small size, light weight, and full curing. It has developed rapidly in recent years and has become the most interesting research hotspot in the field of international optical communication. In the three aspects of LD's chip manufacturing, die (module) packaging and product application, the packaging process and equipment are closer to the market, and have a more direct role in promoting the industry. Among them, LD chip positioning is one of the most critical core technologies in the packaging process. When packaging, it is necessary to ensure that the chip position is correct. The existing chip positioning device generally sets alignment holes on the chip mounting position, but the alignment holes lack...

Claims

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Application Information

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IPC IPC(8): B25B11/00
CPCB25B11/00
Inventor 戴克明杨孟良吴杨波
Owner GUANGDONG RUIGU OPTICAL NETWORK COMM CO LTD
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