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Bonding fixture and bonding method

A bonding fixture and bonding technology, which is applied in the direction of instruments, calculations, electrical digital data processing, etc., can solve problems such as gold finger position deviation and bonding

Active Publication Date: 2022-04-22
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a bonding fixture and a bonding method for the problem that the position of the gold finger tends to shift when the flexible circuit board is bonded to the curved touch panel and cannot be bonded to the binding part.

Method used

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  • Bonding fixture and bonding method
  • Bonding fixture and bonding method
  • Bonding fixture and bonding method

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Embodiment Construction

[0033] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0034] It should be noted that when a component is said to be "fixed" to another component, it can be directly on the other component or there can also be an intervening component. When a component is said to be "connected" to another component, it may be directly connected to the oth...

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PUM

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Abstract

The invention relates to a fitting fixture and a fitting method. The fitting fixture includes a body. The body includes a first surface and a second surface adjacent to and connected to the first surface. The installation groove at the junction of the surface and the first surface, the groove bottom of the installation groove is a plastic curved surface. The present invention avoids the defect of the prior art that when the unbent gold finger is directly attached to the binding part, the position of the gold finger is shifted and cannot be attached to the binding part.

Description

technical field [0001] The invention relates to the technical field of bonding, in particular to a bonding fixture and a bonding method. Background technique [0002] In the prior art, a touch panel includes a substrate and a conductive pattern on the substrate. The substrate has a touch area and a non-touch area. The conductive pattern includes a touch pattern on the touch area of ​​the substrate and a non-touch area on the substrate. The lead pattern has a binding part. In the process of bonding the flexible circuit board to the substrate, it is necessary to use a bonding fixture to bond the gold fingers of the flexible circuit board to the binding portion of the lead pattern. [0003] Considering the low difficulty and high yield rate of planar lamination technology, touch panels are generally planar touch panels (that is, the substrate is a planar substrate), and the bonding area between the flexible circuit board and the touch panel is located on the plane. However, f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041
Inventor 李建德
Owner INTERFACE TECH CHENGDU CO LTD